Xenon (Motherboard)

Xenon

Part Number	X803600
Introduced	Late 2005
Type	Motherboard
Used In	Xbox 360 (Original)
CPU Type	Waternoose
GPU Type	Y1
CPU Process	90nm
GPU Process	90nm
eDRAM Process	90nm
Nand Size	16MB (Retail) 64MB (Dev)
Video Outputs	A/V
Wattage	203W
12V Amperage	16.5A
Successor	Zephyr_A Elpis

For the CPU, see Xenon (CPU).

The Xenon motherboard is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.

Notes

• At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
• Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
• Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
• There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
• At some point in 2006, the extended GPU heatsink started being used instead of the low profile GPU heatsink

Specifications

• 90nm IBM Waternoose DD2.0 or DD3.0 CPU
• 90nm ATi Y1 GPU with integrated 90nm NEC eDRAM
• 512MB GDDR3 RAM
  • 8x64MB Infineon HYB18H512321AF-13
  • 8x64MB Samsung K4J52324QC-BC14
• XSB Southbridge
• ANA
• Nand
  • 16MB Hynix HY27US08281A (Retail)
  • 64MB Samsung K9F1208U0B (Dev)
• Boardcom or ICS Ethernet PHY
• Cypress Clock Generator
• Heatpipe CPU Heatsink
• GPU Heatsink
  • Low Profile (Early/Mid Boards)
  • Extended (Late Boards)

Variations

Elpis

Main article: Elpis (Motherboard)

Elpis is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the Elpis GPU and software differences.