Elpis (Motherboard): Difference between revisions
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=== Specifications === | === Specifications === | ||
* 90nm IBM [[Waternoose | * 90nm IBM [[Waternoose#DD2.0|Waternoose DD2.x or DD3.0]] CPU | ||
* 80nm ATi [[Elpis (GPU)|Elpis]] GPU with integrated 80nm NEC [[eDRAM]] | * 80nm ATi [[Elpis (GPU)|Elpis]] GPU with integrated 80nm NEC [[eDRAM]] | ||
* 512MB GDDR3 RAM | * 512MB GDDR3 RAM |
Revision as of 10:13, 7 February 2023
Part Number | X803600 |
---|---|
Introduced | Early 2009 |
Type | Motherboard |
Used In | Xbox 360 (Original) |
CPU Type | Waternoose2 |
GPU Type | Elpis |
CPU Process | 90nm |
GPU Process | 80nm |
eDRAM Process | 80nm |
Nand Size | 16MB |
Video Outputs | A/V |
Wattage | 203W |
12V Amperage | 16.5A |
The Elpis motherboard is a revision created by Microsoft by modifying a Xenon, and has a different GPU and software. Elpis motherboards were used for refurbishing defective Xenons up until 2011.
Notable Differences
- The 90nm Y1 GPU has been replaced with the 80nm Elpis GPU
- The board uses the 7xxx series CB bootloader instead of the 1xxx series used on Xenon
- The reason for this is unknown as the 1xxx series bootloaders work just fine with Elpis
Specifications
- 90nm IBM Waternoose DD2.x or DD3.0 CPU
- 80nm ATi Elpis GPU with integrated 80nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- Extended GPU Heatsink