Elpis (Motherboard): Difference between revisions
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=== Specifications === | === Specifications === | ||
* 90nm IBM [[Waternoose (CPU)#DD2.0|Waternoose DD2. | * 90nm IBM [[Waternoose (CPU)#DD2.0|Waternoose DD2.x or DD3.0]] CPU | ||
* 80nm ATi [[Elpis (GPU)|Elpis]] GPU with integrated 80nm NEC [[eDRAM]] | * 80nm ATi [[Elpis (GPU)|Elpis]] GPU with integrated 80nm NEC [[eDRAM]] | ||
* 512MB GDDR3 RAM | * 512MB GDDR3 RAM | ||
Revision as of 14:54, 1 January 2023
| Part Number | X803600 |
|---|---|
| Introduced | Early 2009 |
| Type | Motherboard |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose2 |
| GPU Type | Elpis |
| CPU Process | 90nm |
| GPU Process | 80nm |
| eDRAM Process | 80nm |
| Nand Size | 16MB |
| Video Outputs | A/V Multi |
| Wattage | 203W |
| 12V Amperage | 16.5A |
The Elpis motherboard is a revision created by Microsoft out of a Xenon, with exception to the GPU and the software. Elpis motherboards were used for refurbishing defective Xenons up until 2011.
Various part numbers have been spotted on stickers placed on the top edge of Elpis boards. They include:
- X803413
- X805954
- X807381
Notable Differences
- The 90nm Y1 GPU has been replaced with the 80nm Elpis GPU
- The board uses the 7xxx series CB bootloader instead of the 1xxx series used on Xenon
- The reason for this is unknown as the 1xxx series bootloaders work just fine with Elpis
Specifications
- 90nm IBM Waternoose DD2.x or DD3.0 CPU
- 80nm ATi Elpis GPU with integrated 80nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- Extended GPU Heatsink