Xenon (Motherboard): Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
| Line 21: | Line 21: | ||
=== Notes === | === Notes === | ||
* At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU | * At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU | ||
* Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors | * Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors | ||
* Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details) | * Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details) | ||
Revision as of 09:26, 10 July 2023
 | |
| Part Number | X803600 |
|---|---|
| Introduced | Late 2005 |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose |
| GPU Type | Y1 |
| CPU Process | 90nm |
| GPU Process | 90nm |
| eDRAM Process | 90nm |
| Nand Size | 16MB (Retail) 64MB (Dev) |
| Video Outputs | A/V |
| Wattage | 203W |
| 12V Amperage | 16.5A |
| Successor | Zephyr_A Elpis |
Xenon is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.
Notes
- At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
- There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
- At some point in 2006, the extended GPU heatsink started being used on some systems instead of the low profile GPU heatsink
Specifications
- 90nm IBM Waternoose DD2 or DD3 CPU
- 90nm ATi Y1 GPU with integrated 90nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon/Qimonda HYB18H512321AF-13
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- Nand
- 16MB Hynix HY27US08281A (Retail)
- 64MB Samsung K9F1208U0B (Dev)
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- GPU Heatsink
- Low Profile (Early/Mid Boards)
- Extended (Late Boards)
Variations
Elpis
Elpis is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the Elpis GPU and software differences.