Elpis (Motherboard): Difference between revisions
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* Boardcom or ICS Ethernet PHY | * Boardcom or ICS Ethernet PHY | ||
* Cypress Clock Generator | * Cypress Clock Generator | ||
* [[ | * [[Heatsink#Heatpipe CPU|Heatpipe]] CPU Heatsink | ||
* [[ | * [[Heatsink#Extended GPU|Extended]] GPU Heatsink | ||
{{Console Components}} | {{Console Components}} | ||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Revision as of 16:04, 5 June 2023
| Part Number | X803600 |
|---|---|
| Introduced | Early 2009 |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose |
| GPU Type | Elpis |
| CPU Process | 90nm |
| GPU Process | 80nm |
| eDRAM Process | 80nm |
| Nand Size | 16MB |
| Video Outputs | A/V |
| Wattage | 203W |
| 12V Amperage | 16.5A |
| Predecessor | Xenon |
Elpis is a motherboard created by Microsoft by modifying a Xenon, and has a different GPU and software. Elpis motherboards were used for refurbishing defective Xenons up until 2011.
Notable Differences
- The 90nm Y1 GPU has been replaced with the 80nm Elpis GPU
- The board uses the 7xxx series CB bootloader instead of the 1xxx series used on Xenon
- The reason for this is unknown as the 1xxx series CBs work fine with the Elpis GPU.
Specifications
- 90nm IBM Waternoose DD2 or DD3 CPU
- 80nm ATi Elpis GPU with integrated 80nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- Extended GPU Heatsink