Elpis (Motherboard): Difference between revisions
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* The 90nm [[Y1 (GPU)|Y1]] GPU has been replaced with the 80nm [[Elpis (GPU)|Elpis]] GPU | * The 90nm [[Y1 (GPU)|Y1]] GPU has been replaced with the 80nm [[Elpis (GPU)|Elpis]] GPU | ||
* The board uses the 7xxx series [[CB]] bootloader instead of the 1xxx series used on Xenon | * The board uses the 7xxx series [[CB]] bootloader instead of the 1xxx series used on Xenon | ||
** The reason for this is unknown as the 1xxx series bootloaders work just fine with Elpis | ** The reason for this is unknown as the 1xxx series bootloaders work just fine with the [[Elpis (GPU)|Elpis]] GPU. | ||
=== Specifications === | === Specifications === | ||
Revision as of 21:20, 21 February 2023
| Part Number | X803600 |
|---|---|
| Introduced | Early 2009 |
| Type | Motherboard |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose |
| GPU Type | Elpis |
| CPU Process | 90nm |
| GPU Process | 80nm |
| eDRAM Process | 80nm |
| Nand Size | 16MB |
| Video Outputs | A/V |
| Wattage | 203W |
| 12V Amperage | 16.5A |
The Elpis motherboard is a revision created by Microsoft by modifying a Xenon, and has a different GPU and software. Elpis motherboards were used for refurbishing defective Xenons up until 2011.
Notable Differences
- The 90nm Y1 GPU has been replaced with the 80nm Elpis GPU
- The board uses the 7xxx series CB bootloader instead of the 1xxx series used on Xenon
- The reason for this is unknown as the 1xxx series bootloaders work just fine with the Elpis GPU.
Specifications
- 90nm IBM Waternoose DD2.0 or DD3.0 CPU
- 80nm ATi Elpis GPU with integrated 80nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- Extended GPU Heatsink