Elpis (Motherboard): Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
Line 30: | Line 30: | ||
* 80nm ATi [[Elpis (GPU)|Elpis]] GPU with integrated 80nm NEC [[eDRAM]] | * 80nm ATi [[Elpis (GPU)|Elpis]] GPU with integrated 80nm NEC [[eDRAM]] | ||
* 512MB GDDR3 RAM | * 512MB GDDR3 RAM | ||
** 8x64MB [[ | ** 8x64MB [[Infineon RAM#HYB18H1G321AF-14|Infineon HYB18H1G321AF-14]] | ||
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]] | ** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]] | ||
* [[XSB]] Southbridge | * [[XSB]] Southbridge |
Revision as of 22:55, 3 January 2023
Part Number | X803600 |
---|---|
Introduced | Early 2009 |
Type | Motherboard |
Used In | Xbox 360 (Original) |
CPU Type | Waternoose2 |
GPU Type | Elpis |
CPU Process | 90nm |
GPU Process | 80nm |
eDRAM Process | 80nm |
Nand Size | 16MB |
Video Outputs | A/V Multi |
Wattage | 203W |
12V Amperage | 16.5A |
The Elpis motherboard is a revision created by Microsoft out of a Xenon, with exception to the GPU and the software. Elpis motherboards were used for refurbishing defective Xenons up until 2011.
Notable Differences
- The 90nm Y1 GPU has been replaced with the 80nm Elpis GPU
- The board uses the 7xxx series CB bootloader instead of the 1xxx series used on Xenon
- The reason for this is unknown as the 1xxx series bootloaders work just fine with Elpis
Specifications
- 90nm IBM Waternoose DD2.x or DD3.0 CPU
- 80nm ATi Elpis GPU with integrated 80nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- Extended GPU Heatsink