Xenon (Motherboard): Difference between revisions
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* Boardcom or ICS Ethernet PHY | * Boardcom or ICS Ethernet PHY | ||
* Cypress Clock Generator | * Cypress Clock Generator | ||
* [[Heatsinks#Heatpipe CPU|Heatpipe]] CPU Heatsink | |||
* GPU Heatsink | |||
** [[Heatsinks#Low Profile GPU|Low Profile]] (Early/Mid Boards) | |||
** [[Heatsinks#Extended GPU|Extended]] (Late Boards) | |||
== Elpis == | == Elpis == | ||
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* Boardcom or ICS Ethernet PHY | * Boardcom or ICS Ethernet PHY | ||
* Cypress Clock Generator | * Cypress Clock Generator | ||
* [[Heatsinks#Heatpipe CPU|Heatpipe]] CPU Heatsink | |||
* [[Heatsinks#Extended GPU|Extended]] GPU Heatsink | |||
{{Console Components}} | {{Console Components}} | ||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Revision as of 23:01, 22 December 2022
| Part Number | X803600 |
|---|---|
| Introduced | Late 2005 |
| Type | Motherboard |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose2 |
| GPU Type | Y1 |
| CPU Process | 90nm |
| GPU Process | 90nm |
| eDRAM Process | 90nm |
| Nand Size | 16MB |
| Video Outputs | A/V Multi |
| Wattage | 203W |
| 12V Amperage | 16.5A |
| Successor | Zephyr_A |
The Xenon motherboard is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.
Notes
- At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
- At some point in 2006, the extended GPU heatsink started being used instead of the low profile GPU heatsink
- There are two different versions of Xenon, G0 and R0, however the difference between them is not known
Specifications
- 90nm IBM Waternoose2 CPU
- 90nm ATi Y1 GPU with integrated 90nm NEC eDRAM
- 512MB DDR3 RAM
- 8x64MB Infineon HYB18H512322AF-13
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- GPU Heatsink
- Low Profile (Early/Mid Boards)
- Extended (Late Boards)
Elpis
The Elpis motherboard is made out of a Xenon, with exception to the GPU and the software. Elpis motherboards were used for refurbishing defective Xenons up until 2011.
Various part numbers have been spotted on stickers placed on the top edge of Elpis boards. They include:
- X803413
- X805954
- X807381
Notable Differences
- The 90nm Y1 GPU has been replaced with the 80nm Elpis GPU
- The board uses the 7xxx series CB bootloader instead of the 1xxx series used on Xenon
- The reason for this is unknown as the 1xxx series bootloaders work just fine with Elpis
Specifications
- 90nm IBM Waternoose2 CPU
- 80nm ATi Elpis GPU with integrated 80nm NEC eDRAM
- 512MB DDR3 RAM
- 8x64MB Infineon HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- Extended GPU Heatsink