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{{Infobox Motherboard
{{Infobox Motherboard
| name        = Xenon
| name        = Xenon
| image        = X803600-011.jpg
| introduced  = Late 2005
| introduced  = Late 2005
| partnumber  = X803600
| partnumber  = X803600
| type        = Motherboard
| usedin      = [[Xbox 360 (Original)]]
| usedin      = [[Xbox 360 (Original)]]
| cputype      = [[Waternoose (CPU)#Waternoose2|Waternoose2]]
| cputype      = [[Waternoose]]
| gputype      = [[Y1 (GPU)|Y1]]
| gputype      = [[Y1 (GPU)|Y1]]
| cpuprocess  = 90nm
| cpuprocess  = 90nm
| gpuprocess  = 90nm
| gpuprocess  = 90nm
| edramprocess = 90nm
| edramprocess = 90nm
| nandsize    = 16MB
| nandsize    = 16MB (Retail)<br>64MB (Dev)
| video        = [[A/V Multi]]
| video        = [[A/V]]
| wattage      = 203W
| wattage      = 203W
| 12vamps      = 16.5A
| 12vamps      = 16.5A
| successor    = [[Zephyr|Zephyr_A]]
| successor    = [[Zephyr|Zephyr_A]]<br>[[Elpis (Motherboard)|Elpis]]
}}
}}
{{for|the CPU|Xenon (CPU)}}


The '''Xenon''' motherboard is the first motherboard and is used in the [[Original Xbox 360]] series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the [[ANA]] chip.
'''Xenon''' is the first [[motherboard]] and is used in the [[Original Xbox 360]] series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the [[ANA]] chip.


=== Notes ===
=== Notes ===
* At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
* At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU
* Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
* Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
* Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details)
* Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details)
* At some point in 2006, the [[Heatsinks#Extended GPU| extended]] GPU heatsink started being used instead of the [[Heatsinks#Low Profile GPU|low profile]] GPU heatsink
* There are two different versions of the [[XSB]] southbridge used, initially [[XSB#G0|G0]], and later switching to [[XSB#R0|R0]]
* There are two different versions of Xenon, G0 and R0, however the difference between them is not known
* At some point in 2006, the [[Heatsink#Extended GPU| extended]] GPU heatsink started being used on some systems instead of the [[Heatsink#Low Profile GPU|low profile]] GPU heatsink


=== Specifications ===
=== Specifications ===
* 90nm IBM [[Waternoose (CPU)#Waternoose2|Waternoose2]] CPU
* 90nm [[Waternoose#DD2|Waternoose DD2 or DD3]] CPU
* 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm [[eDRAM]]
* 90nm [[Y1 (GPU)|Y1]] GPU/eDRAM
* 512MB DDR3 RAM
* 512MB GDDR3 RAM
** 8x64MB [[Qimonda RAM#HYB18H512322AF-13|Infineon HYB18H512322AF-13]]
** 8x64MB [[Infineon RAM#HYB18H512321AF-13|Infineon/Qimonda HYB18H512321AF-13]]
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]]
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]]
* [[XSB]] Southbridge
* [[XSB]] Southbridge  
* [[ANA]]
* [[ANA]]
* 16MB [[Nand#Hynix HY27US08281A|Hynix HY27US08281A]] Nand
* Nand
* Boardcom or ICS Ethernet PHY
** 16MB [[Nand#Hynix HY27US08281A|Hynix HY27US08281A]] ([[Retail|Retail]])
** 64MB [[Nand#Samsung K9F1208U0B|Samsung K9F1208U0B]] ([[Developer Hardware|Dev]])
* Boardcom or ICS [[Ethernet PHY]]
* Cypress Clock Generator
* Cypress Clock Generator
* [[Heatsink#Heatpipe CPU|Heatpipe]] CPU Heatsink
* GPU Heatsink
** [[Heatsink#Low Profile GPU|Low Profile]] (Early/Mid Boards)
** [[Heatsink#Extended GPU|Extended]] (Late Boards)


== Elpis ==
== Variations ==
{{Infobox Component
| name        = Elpis
| introduced  = Early 2009
| partnumber  = X803600
| type        = Motherboard
| usedin      = [[Xbox 360 (Original)]]
| cputype      = [[Waternoose (CPU)#Waternoose2|Waternoose2]]
| gputype      = [[Elpis (GPU)|Elpis]]
| cpuprocess  = 90nm
| gpuprocess  = 80nm
| edramprocess = 80nm
| nandsize    = 16MB
| video        = [[A/V Multi]]
| wattage      = 203W
| 12vamps      = 16.5A
}}
 
The '''Elpis''' motherboard is made out of a [[#top|Xenon]], with exception to the GPU and the software. Elpis motherboards were used for refurbishing defective Xenons up until 2011.


Various part numbers have been spotted on stickers placed on the top edge of Elpis boards. They include:
=== Elpis ===
* X803413
{{Main|Elpis (Motherboard)}}
* X805954
* X807381


=== Notable Differences ===
[[Elpis (Motherboard)|Elpis]] is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the [[Elpis (GPU)|Elpis]] GPU and software differences.
* The 90nm [[Y1 (GPU)|Y1]] GPU has been replaced with the 80nm [[Elpis (GPU)|Elpis]] GPU
* The board uses the 7xxx series [[CB]] bootloader instead of the 1xxx series used on Xenon
** The reason for this is unknown as the 1xxx series bootloaders work just fine with Elpis
 
=== Specifications ===
* 90nm IBM [[Waternoose (CPU)#Waternoose2|Waternoose2]] CPU
* 80nm ATi [[Elpis (GPU)|Elpis]] GPU with integrated 80nm [[eDRAM]]
* 512MB DDR3 RAM
** 8x64MB [[Qimonda RAM#HYB18H1G321AF-14|Infineon HYB18H1G321AF-14]]
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]]
* [[XSB]] Southbridge
* [[ANA]]
* 16MB [[Nand#Hynix HY27US08281A|Hynix HY27US08281A]] Nand
* Boardcom or ICS Ethernet PHY
* Cypress Clock Generator


{{Console Components}}
{{Console Components}}
[[Category:Motherboards]]
[[Category:Motherboards]]

Latest revision as of 05:07, 5 April 2024

Xenon
X803600-011.jpg
Part NumberX803600
IntroducedLate 2005
Used InXbox 360 (Original)
CPU TypeWaternoose
GPU TypeY1
CPU Process90nm
GPU Process90nm
eDRAM Process90nm
Nand Size16MB (Retail)
64MB (Dev)
Video OutputsA/V
Wattage203W
12V Amperage16.5A
SuccessorZephyr_A
Elpis
For the CPU, see Xenon (CPU).

Xenon is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.

Notes

  • At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU
  • Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
  • Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
  • There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
  • At some point in 2006, the extended GPU heatsink started being used on some systems instead of the low profile GPU heatsink

Specifications

Variations

Elpis

Main article: Elpis (Motherboard)

Elpis is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the Elpis GPU and software differences.

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