Xenon (Motherboard): Difference between revisions
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{{for|the CPU|Xenon (CPU)}} | {{for|the CPU|Xenon (CPU)}} | ||
'''Xenon''' is the first [[motherboard]] and is used in the [[Original Xbox 360]] series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the [[ANA]] chip. | |||
=== Notes === | === Notes === | ||
* At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU | * At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU | ||
* Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors | * Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors | ||
* Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details) | * Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details) | ||
* There are two different versions of the [[XSB]] southbridge used, initially [[XSB#G0|G0]], and later switching to [[XSB#R0|R0]] | * There are two different versions of the [[XSB]] southbridge used, initially [[XSB#G0|G0]], and later switching to [[XSB#R0|R0]] | ||
* At some point in 2006, the [[ | * At some point in 2006, the [[Heatsink#Extended GPU| extended]] GPU heatsink started being used on some systems instead of the [[Heatsink#Low Profile GPU|low profile]] GPU heatsink | ||
=== Specifications === | === Specifications === | ||
* 90nm | * 90nm [[Waternoose#DD2|Waternoose DD2 or DD3]] CPU | ||
* 90nm | * 90nm [[Y1 (GPU)|Y1]] GPU/eDRAM | ||
* 512MB GDDR3 RAM | * 512MB GDDR3 RAM | ||
** 8x64MB [[Infineon RAM#HYB18H512321AF-13|Infineon HYB18H512321AF-13]] | ** 8x64MB [[Infineon RAM#HYB18H512321AF-13|Infineon/Qimonda HYB18H512321AF-13]] | ||
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]] | ** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]] | ||
* [[XSB]] Southbridge | * [[XSB]] Southbridge | ||
| Line 38: | Line 38: | ||
** 16MB [[Nand#Hynix HY27US08281A|Hynix HY27US08281A]] ([[Retail|Retail]]) | ** 16MB [[Nand#Hynix HY27US08281A|Hynix HY27US08281A]] ([[Retail|Retail]]) | ||
** 64MB [[Nand#Samsung K9F1208U0B|Samsung K9F1208U0B]] ([[Developer Hardware|Dev]]) | ** 64MB [[Nand#Samsung K9F1208U0B|Samsung K9F1208U0B]] ([[Developer Hardware|Dev]]) | ||
* Boardcom or ICS Ethernet PHY | * Boardcom or ICS [[Ethernet PHY]] | ||
* Cypress Clock Generator | * Cypress Clock Generator | ||
* [[ | * [[Heatsink#Heatpipe CPU|Heatpipe]] CPU Heatsink | ||
* GPU Heatsink | * GPU Heatsink | ||
** [[ | ** [[Heatsink#Low Profile GPU|Low Profile]] (Early/Mid Boards) | ||
** [[ | ** [[Heatsink#Extended GPU|Extended]] (Late Boards) | ||
== Variations == | == Variations == | ||
| Line 50: | Line 50: | ||
{{Main|Elpis (Motherboard)}} | {{Main|Elpis (Motherboard)}} | ||
[[Elpis (Motherboard)|Elpis]] is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the [[Elpis (GPU)|Elpis]] GPU and software differences. | |||
{{Console Components}} | {{Console Components}} | ||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Latest revision as of 05:07, 5 April 2024
 | |
| Part Number | X803600 |
|---|---|
| Introduced | Late 2005 |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose |
| GPU Type | Y1 |
| CPU Process | 90nm |
| GPU Process | 90nm |
| eDRAM Process | 90nm |
| Nand Size | 16MB (Retail) 64MB (Dev) |
| Video Outputs | A/V |
| Wattage | 203W |
| 12V Amperage | 16.5A |
| Successor | Zephyr_A Elpis |
Xenon is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.
Notes
- At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
- There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
- At some point in 2006, the extended GPU heatsink started being used on some systems instead of the low profile GPU heatsink
Specifications
- 90nm Waternoose DD2 or DD3 CPU
- 90nm Y1 GPU/eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon/Qimonda HYB18H512321AF-13
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- Nand
- 16MB Hynix HY27US08281A (Retail)
- 64MB Samsung K9F1208U0B (Dev)
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- GPU Heatsink
- Low Profile (Early/Mid Boards)
- Extended (Late Boards)
Variations
Elpis
Elpis is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the Elpis GPU and software differences.