Falcon: Difference between revisions
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* The J7G3 [[Titan]] connector on the front of the motherboard was left on the final motherboard | * The J7G3 [[Titan]] connector on the front of the motherboard was left on the final motherboard | ||
* Some later boards use solid state capacitors for the CPU and GPU output filters | * Some later boards use solid state capacitors for the CPU and GPU output filters | ||
* The [[ | * The [[Heatsink#Heatpipe CPU|heatpipe]] CPU heatsink was replaced with the [[Heatsink#Aluminum CPU| aluminum]] CPU heatsink, however some early boards did not have this change | ||
=== Specifications === | === Specifications === | ||
| Line 46: | Line 46: | ||
** 64MB [[Nand#Samsung K9F1208U0B|Samsung K9F1208U0B]] ([[Developer Hardware|Dev]]) | ** 64MB [[Nand#Samsung K9F1208U0B|Samsung K9F1208U0B]] ([[Developer Hardware|Dev]]) | ||
* Boardcom or ICS Ethernet PHY | * Boardcom or ICS Ethernet PHY | ||
* [[ | * [[Heatsink#Aluminum CPU|Aluminum]] CPU Heatsink | ||
** [[ | ** [[Heatsink#Heatpipe CPU|Heatpipe]] CPU Heatsink used on early units | ||
* [[ | * [[Heatsink#Extended GPU|Extended]] GPU Heatsink | ||
== Opus == | == Opus == | ||
Revision as of 17:05, 5 June 2023
 | |
| Part Number | X812320 |
|---|---|
| Introduced | Late 2007 |
| Used In | Xbox 360 (Original) |
| CPU Type | Loki |
| GPU Type | Rhea |
| CPU Process | 65nm |
| GPU Process | 80nm |
| eDRAM Process | 80nm |
| Nand Size | 16MB (Retail) 64MB (Dev) |
| Video Outputs | A/V and HDMI |
| Wattage | 175W |
| 12V Amperage | 14.2A |
| Predecessor | Zephyr_C |
| Successor | Jasper |
Falcon is the successor to the Zephyr_C motherboard and is used in the Original Xbox 360 series.
Notable Differences
- The 90nm Waternoose CPU has been replaced with the 65nm Loki CPU
- When the revised GPUs rolled out, around March 2008, all board started using Qimonda HYB18H1G321AF-14 RAM in a 4x128MB config
- Qimonda HYB18H512322AF-13 RAM has been replaced with Qimonda HYB18H512321BF-14
- When the revised GPUs rolled out, Hynix HY5RS123235BFP-14 and Qimonda HYB18H512321BF-13 RAM are no longer used
- Around March 2008, fixed GPUs started being used
- The CPU voltage regulation is now 2 phases, down from 3 phases, but the pads and silkscreen for the third phase still remain
- The board layout has been modified to support the 65nm CPU
- Other small changes were made to the board layout
- The J7G3 Titan connector on the front of the motherboard was left on the final motherboard
- Some later boards use solid state capacitors for the CPU and GPU output filters
- The heatpipe CPU heatsink was replaced with the aluminum CPU heatsink, however some early boards did not have this change
Specifications
- 65nm IBM Loki CPU
- 80nm ATi Rhea GPU with integrated 80nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Hynix HY5RS123235BFP-14 (Early Boards)
- 8x64MB Qimonda HYB18H512321BF-14 (Early Boards)
- 4x128MB Qimonda HYB18H1G321AF-14 (Mid/Late Boards)
- XSB R0 Southbridge
- HANA
- Nand
- 16MB Hynix HY27US08281A (Retail)
- 64MB Samsung K9F1208U0B (Dev)
- Boardcom or ICS Ethernet PHY
- Aluminum CPU Heatsink
- Heatpipe CPU Heatsink used on early units
- Extended GPU Heatsink
Opus
The Opus name describes a project of fitting a Falcon board into the casings for a Xenon. This was done with a custom A/V port, and the removal of the HDMI port. Opus was used for refurbishing defective consoles until the Elpis boards started being produced.
Notable Differences
- Removal of the HDMI port
- Custom A/V port to fit the HDMI board layout while being able to fit into the Xenon casing
- All Opus boards use revised versions of the Rhea GPU with higher Tg underfill
- All Opus boards use 4x128MB Qimonda HYB18H1G321AF-14 RAM