Jasper
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Part Number | X815842 |
---|---|
Introduced | Late 2008 |
Type | Motherboard |
Used In | Xbox 360 (Original) |
CPU Type | Loki |
GPU Type | Zeus |
CPU Process | 65nm |
GPU Process | 65nm |
eDRAM Process | 80nm |
Nand Size | 16MB, 256MB, 512MB |
Video Outputs | A/V and HDMI |
Wattage | 150W |
12V Amperage | 12.1A |
Predecessor | Falcon |
Successor | Jasper Tonasket |
The Jasper is the successor to the Falcon and is used in the Original Xbox 360 series.
Notable Differences
- The 80nm Rhea GPU has been replaced with the 65nm Zeus GPU
- Hynix H5RS5223CFR-14C and Hynix H5RS1H23MFR-14C RAM were added as options
- The XSB has been replaced with the PSB
- Arcade Jaspers came with 256MB (later 512MB) nand chips that combine system storage and a Memory Unit
- Traces and pads for an additional flash controller (referred to as "DUMBO" or "PANDA") have been added, but never populated
- Other small changes were made to the board layout
- Very late Jaspers manufactured in July 2009 come with the Kronos GPU instead of the Zeus GPU
- Some of the boards no longer have glue applied around the CPU and GPU
Specifications
- 65nm IBM Loki CPU
- 65nm ATi Zeus GPU with integrated 80nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Hynix H5RS5223CFR-14C
- 4x128MB Hynix H5RS1H23MFR-14C
- 4x128MB Qimonda HYB18H1G321AF-14
- PSB Southbridge
- HANA
- Nand
- 16MB Hynix HY27US08281A
- 256MB Hynix HY27UF082G2B
- 512MB Hynix HY27UF084G2B
- 512MB Samsung K9F4G08U0B
- Boardcom or ICS Ethernet PHY
- Aluminum CPU Heatsink
- Extended GPU Heatsink
Tonasket
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Part Number | X820379 |
---|---|
Introduced | Late 2009 |
Type | Motherboard |
Used In | Xbox 360 (Original) |
CPU Type | Loki |
GPU Type | Kronos |
CPU Process | 65nm |
GPU Process | 65nm |
eDRAM Process | 65nm |
Nand Size | 16MB, 512MB |
Video Outputs | A/V and HDMI |
Wattage | 150W |
12V Amperage | 12.1A |
Predecessor | Jasper |
Successor | Trinity |
The Jasper Tonasket (also known as Kronos) is the successor to the Jasper, and is the final motherboard used in the Original Xbox 360 series. Despite having a different name, it is still considered a "Jasper" by Microsoft.
Notable Differences
- The 65nm Zeus GPU has been replaced with the 65nm Kronos GPU, which shrinks the eDRAM to 65nm
- Samsung K4J10324QD-HC14 RAM was added as an option
- Hynix H5RS5223CFR-14C RAM is no longer used
- 8x64MB RAM configurations are no longer used, but still supported by the motherboard
- The 256MB nand chip was no longer used, only 512MB configurations were used in the Arcade SKU
- The additional traces and pads for DUMBO/PANDA flash controller were removed
- An alternate simplified standby circuit for V_3P3STBY and V_1P8STBY was added, but only some manufacturers used it
- The board layout was cleaned up
- All motherboards use an updated RF02 board
- The extended GPU heatsink was reverted back to the low profile GPU heatsink
- All boards now use solid state capacitors for the CPU and GPU output filters
- There is no longer glue applied around the CPU and GPU
Specifications
- 65nm IBM Loki CPU
- 65nm ATi Kronos GPU with integrated 65nm NEC eDRAM
- 512MB GDDR3 RAM
- 4x128MB Hynix H5RS1H23MFR-14C
- 4x128MB Qimonda HYB18H1G321AF-14
- 4x128MB Samsung K4J10324QD-HC14
- PSB Southbridge
- HANA
- Nand
- 16MB Hynix HY27US08281A
- 512MB Hynix HY27UF084G2B
- 512MB Samsung K9F4G08U0B
- Boardcom or ICS Ethernet PHY
- Aluminum CPU Heatsink
- Low Profile GPU Heatsink