Xenon (Motherboard)
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| Part Number | X803600 |
|---|---|
| Introduced | Late 2005 |
| Type | Motherboard |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose2 |
| GPU Type | Y1 |
| CPU Process | 90nm |
| GPU Process | 90nm |
| eDRAM Process | 90nm |
| Nand Size | 16MB |
| Video Outputs | A/V Multi |
| Wattage | 203W |
| 12V Amperage | 16.5A |
| Successor | Zephyr_A |
The Xenon motherboard is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.
Notes
- At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
- There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
- At some point in 2006, the extended GPU heatsink started being used instead of the low profile GPU heatsink
Specifications
- 90nm IBM Waternoose2 CPU
- 90nm ATi Y1 GPU with integrated 90nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon HYB18H512322AF-13
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge (G0 or R0)
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- GPU Heatsink
- Low Profile (Early/Mid Boards)
- Extended (Late Boards)