Jasper
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 | |
| Part Number | X815842 |
|---|---|
| Introduced | Late 2008 |
| Used In | Xbox 360 (Original) |
| CPU Type | Loki |
| GPU Type | Zeus |
| CPU Process | 65nm |
| GPU Process | 65nm |
| eDRAM Process | 90nm |
| Nand Size | 16MB, 256MB, 512MB |
| Video Outputs | A/V and HDMI |
| Wattage | 150W |
| 12V Amperage | 12.1A |
| Predecessor | Falcon |
| Successor | Tonasket |
Jasper is the successor to the Falcon motherboard and is used in the Original Xbox 360 series.
Notable Differences
- The 90nm Rhea GPU has been replaced with the 65nm Zeus GPU
- Hynix H5RS5223CFR-14C and Hynix H5RS1H23MFR-14C RAM were added as options
- The XSB Southbridge has been replaced with the PSB Southbridge
- Arcade Jaspers came with 256MB (later 512MB) nand chips that combine system storage and a Memory Unit
- Traces and pads for an additional flash controller (referred to as "DUMBO" or "PANDA") have been added, but never populated
- Very late Jaspers manufactured in July 2009 come with the Kronos GPU instead of the Zeus GPU
- Some boards use solid state capacitors for the CPU and GPU output filters
- Some of the boards no longer have glue applied around the CPU and GPU
Specifications
- 65nm IBM Loki CPU
- 65nm ATi Zeus GPU with integrated 90nm NEC eDRAM
- 512MB GDDR3 RAM
- 8x64MB Hynix H5RS5223CFR-14C
- 4x128MB Hynix H5RS1H23MFR-14C
- 4x128MB Qimonda HYB18H1G321AF-14
- PSB Southbridge
- HANA
- Nand
- 16MB Hynix HY27US08281A
- 256MB Hynix HY27UF082G2B
- 512MB Hynix HY27UF084G2B
- 512MB Samsung K9F4G08U0B
- Boardcom or ICS Ethernet PHY
- Aluminum CPU Heatsink
- Extended GPU Heatsink
Variations
XDK-GB
Jasper was modified slightly for the Xbox 360-GB Development Console. Support for 1GB of RAM was added by routing the 13th addressing line. Other minor changes and cleanup were made. The exact board name is unknown but begins with an 'A', hardware phases included AEV, ADV, and APV. Early versions use the Zeus GPU, while later boards used Kronos.
Tonasket
Tonasket is a minor revision of Jasper. Major changes include use of the Kronos GPU and board layout cleanup.