Tonasket: Difference between revisions
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* The board layout was cleaned up | * The board layout was cleaned up | ||
* All motherboards use an updated [[RF Board#RF02|RF02]] board | * All motherboards use an updated [[RF Board#RF02|RF02]] board | ||
* The [[ | * The [[Heatsink#Extended GPU| extended]] GPU heatsink was reverted back to the [[Heatsink#Low Profile GPU|low profile]] GPU heatsink | ||
* All boards now use solid state capacitors for the CPU and GPU output filters | * All boards now use solid state capacitors for the CPU and GPU output filters | ||
* There is no longer glue applied around the CPU and GPU | * There is no longer glue applied around the CPU and GPU | ||
| Line 50: | Line 50: | ||
** 512MB [[Nand#Samsung K9F4G08U0B|Samsung K9F4G08U0B]] | ** 512MB [[Nand#Samsung K9F4G08U0B|Samsung K9F4G08U0B]] | ||
* Boardcom or ICS Ethernet PHY | * Boardcom or ICS Ethernet PHY | ||
* [[ | * [[Heatsink#Aluminum CPU|Aluminum]] CPU Heatsink | ||
* [[ | * [[Heatsink#Low Profile GPU|Low Profile]] GPU Heatsink | ||
{{Console Components}} | {{Console Components}} | ||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Revision as of 16:06, 5 June 2023
 | |
| Part Number | X820379 |
|---|---|
| Introduced | Late 2009 |
| Used In | Xbox 360 (Original) |
| CPU Type | Loki |
| GPU Type | Kronos |
| CPU Process | 65nm |
| GPU Process | 65nm |
| eDRAM Process | 65nm |
| Nand Size | 16MB, 512MB |
| Video Outputs | A/V and HDMI |
| Wattage | 150W |
| 12V Amperage | 12.1A |
| Predecessor | Jasper |
| Successor | Trinity |
Tonasket is the successor to the Jasper, and is the final motherboard used in the Original Xbox 360 series. It is considered a revision of Jasper despite having its own name.
Commonly referred to by the community (but not by Microsoft) as "Kronos", a reference to the GPU used.
Notable Differences
- The 65nm Zeus GPU has been replaced with the 65nm Kronos GPU, which shrinks the eDRAM to 65nm
- Samsung K4J10324QD-HC14 RAM was added as an option
- Hynix H5RS5223CFR-14C RAM is no longer used
- 8x64MB RAM configurations are no longer used, but still supported by the motherboard
- The 256MB nand chip was no longer used, only 512MB configurations were used in the Arcade SKU
- The additional traces and pads for DUMBO/PANDA flash controller were removed
- An alternate simplified standby circuit for V_3P3STBY and V_1P8STBY was added, but only some manufacturers used it
- The board layout was cleaned up
- All motherboards use an updated RF02 board
- The extended GPU heatsink was reverted back to the low profile GPU heatsink
- All boards now use solid state capacitors for the CPU and GPU output filters
- There is no longer glue applied around the CPU and GPU
Specifications
- 65nm IBM Loki CPU
- 65nm ATi Kronos GPU with integrated 65nm NEC eDRAM
- 512MB GDDR3 RAM
- 4x128MB Hynix H5RS1H23MFR-14C
- 4x128MB Qimonda HYB18H1G321AF-14
- 4x128MB Samsung K4J10324QD-HC14
- PSB Southbridge
- HANA
- Nand
- 16MB Hynix HY27US08281A
- 512MB Hynix HY27UF084G2B
- 512MB Samsung K9F4G08U0B
- Boardcom or ICS Ethernet PHY
- Aluminum CPU Heatsink
- Low Profile GPU Heatsink