Zephyr: Difference between revisions
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* The layout and specifications of the major filtering capacitors has changed | * The layout and specifications of the major filtering capacitors has changed | ||
* All manufacturers now apply glue around the CPU and GPU | * All manufacturers now apply glue around the CPU and GPU | ||
== Zephyr_B == | == Zephyr_B == | ||
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=== Notable Differences === | === Notable Differences === | ||
* The 90nm [[Y1 (GPU)|Y1]] GPU has been replaced with the 80nm [[Y2 (GPU)|Y2]] GPU | * The 90nm [[Y1 (GPU)|Y1]] GPU has been replaced with the 80nm [[Y2 (GPU)|Y2]] GPU | ||
* The [[PCIe]] pads under the GPU have been de-swizzled in order to support the Y2 GPU | * The [[PCIe]] pads under the GPU have been de-swizzled in order to support the Y2 GPU | ||
* The [[Heatsinks#Extended GPU| extended]] GPU heatsink is always used, in place of the [[Heatsinks#Low Profile GPU|low profile]] GPU heatsink | |||
== Zephyr_C == | == Zephyr_C == | ||
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* 90nm IBM [[Waternoose#DD3.0|Waternoose DD3.0]] CPU | * 90nm IBM [[Waternoose#DD3.0|Waternoose DD3.0]] CPU | ||
* GPU | * GPU | ||
** 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm NEC [[eDRAM]] ( | ** 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm NEC [[eDRAM]] (Zephyr_A) | ||
** 80nm ATi [[Y2 (GPU)|Y2]] GPU with integrated 90nm NEC [[eDRAM]] ( | ** 80nm ATi [[Y2 (GPU)|Y2]] GPU with integrated 90nm NEC [[eDRAM]] (Zephyr_B) | ||
** 80nm ATi [[Rhea]] GPU with integrated 80nm NEC [[eDRAM]] ( | ** 80nm ATi [[Rhea]] GPU with integrated 80nm NEC [[eDRAM]] (Zephyr_C) | ||
* 512MB GDDR3 RAM | * 512MB GDDR3 RAM | ||
** 8x64MB [[Hynix RAM#HY5RS123235BFP-14|Hynix HY5RS123235BFP-14]] | ** 8x64MB [[Hynix RAM#HY5RS123235BFP-14|Hynix HY5RS123235BFP-14]] | ||
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* [[Heatsinks#Heatpipe CPU|Heatpipe]] CPU Heatsink | * [[Heatsinks#Heatpipe CPU|Heatpipe]] CPU Heatsink | ||
* [[Heatsinks#Extended GPU|Extended]] GPU Heatsink | * [[Heatsinks#Extended GPU|Extended]] GPU Heatsink | ||
** [[Heatsinks#Low Profile GPU|Low Profile]] GPU Heatsink used on early Zephyr_A units | |||
{{Console Components}} | {{Console Components}} | ||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Revision as of 09:56, 20 March 2023
 A Zephyr_C | |
| Part Number | X810385 (A) X810387 (B/C) |
|---|---|
| Introduced | Late 2006 (A) Early 2007 (B) Mid 2007 (C) |
| Type | Motherboard |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose |
| GPU Type | Y1 (A) Y2 (B) Rhea (C) |
| CPU Process | 90nm |
| GPU Process | 90nm (A) 80nm (B/C) |
| eDRAM Process | 90nm (A/B) 80nm (C) |
| Nand Size | 16MB (Retail) 64MB (Dev) |
| Video Outputs | A/V and HDMI |
| Wattage | 203W |
| 12V Amperage | 16.5A |
| Predecessor | Xenon |
| Successor | Falcon |
The Zephyr motherboard has 3 different versions with very minor differences.
Zephyr_A
Zephyr_A is the successor to Xenon and is used in the Original Xbox 360 series. It is the first motherboard to feature HDMI.
Notable Differences
- Redesigned and cleaned up board layout
- Hynix HY5RS123235BFP-14 RAM was added as an option
- Samsung K4J52324QC-BC14 RAM has been replaced with Samsung K4J52324QE-BC14
- Infineon HYB18H512321AF-13 RAM has been rebranded and replaced with Qimonda HYB18H512322AF-13
- ANA has been replaced with HANA, which adds HDMI support
- The Cypress clock generator has been removed, and its functionality has been integrated into the HANA
- An HDMI port has been added
- The layout and specifications of the major filtering capacitors has changed
- All manufacturers now apply glue around the CPU and GPU
Zephyr_B
Zephyr_B is the successor to Zephyr_A and is used in the Original Xbox 360 series.
Notable Differences
- The 90nm Y1 GPU has been replaced with the 80nm Y2 GPU
- The PCIe pads under the GPU have been de-swizzled in order to support the Y2 GPU
- The extended GPU heatsink is always used, in place of the low profile GPU heatsink
Zephyr_C
Zephyr_C is the successor to Zephyr_B and is used in the Original Xbox 360 series. The part number is the same as Zephyr_B, as the PCB itself did not change.
Notable Differences
Common
Specifications
- 90nm IBM Waternoose DD3.0 CPU
- GPU
- 512MB GDDR3 RAM
- 8x64MB Hynix HY5RS123235BFP-14
- 8x64MB Qimonda HYB18H512322AF-13
- 8x64MB Samsung K4J52324QE-BC14
- XSB R0 Southbridge
- HANA
- Nand
- 16MB Hynix HY27US08281A (Retail)
- 64MB Samsung K9F1208U0B (Dev)
- Boardcom or ICS Ethernet PHY
- Heatpipe CPU Heatsink
- Extended GPU Heatsink
- Low Profile GPU Heatsink used on early Zephyr_A units