Elpis (Motherboard): Difference between revisions
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* The 90nm [[Y1 (GPU)|Y1]] GPU has been replaced with the 90nm [[Elpis (GPU)|Elpis]] GPU | * The 90nm [[Y1 (GPU)|Y1]] GPU has been replaced with the 90nm [[Elpis (GPU)|Elpis]] GPU | ||
* The board uses the 7xxx series [[CB]] bootloader instead of the 1xxx series used on Xenon | * The board uses the 7xxx series [[CB]] bootloader instead of the 1xxx series used on Xenon | ||
** | ** This is due to clashing of [[GPU#Xenos_C2]] GPU and [[Samsung RAM#K4J52324QC-BC14|Samsung QC]] RAM, and to ensure the correct [[HWINIT]] is used | ||
=== Specifications === | === Specifications === |
Revision as of 23:16, 23 August 2024
Part Number | X803600 |
---|---|
Introduced | Early 2009 |
Used In | Xbox 360 (Original) |
CPU Type | Waternoose |
GPU Type | Elpis |
CPU Process | 90nm |
GPU Process | 90nm |
eDRAM Process | 90nm |
Nand Size | 16MB |
Video Outputs | A/V |
Wattage | 203W |
12V Amperage | 16.5A |
Predecessor | Xenon |
Elpis is a motherboard created by Microsoft by modifying a Xenon, and has a different GPU and software. Elpis motherboards were used for refurbishing defective Xenons up until 2011.
Notable Differences
- The 90nm Y1 GPU has been replaced with the 90nm Elpis GPU
- The board uses the 7xxx series CB bootloader instead of the 1xxx series used on Xenon
- This is due to clashing of GPU#Xenos_C2 GPU and Samsung QC RAM, and to ensure the correct HWINIT is used
Specifications
- 90nm Waternoose DD2 or DD3 CPU
- 90nm Elpis GPU/eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon/Qimonda HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- Extended GPU Heatsink