Winchester: Difference between revisions
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| usedin = [[Xbox 360 E]] | | usedin = [[Xbox 360 E]] | ||
| cgputype = [[Oban]] | | cgputype = [[Oban]] | ||
| cgpuprocess = | | cgpuprocess = 32nm | ||
| nandsize = 16MB or 4GB | | nandsize = 16MB or 4GB | ||
| video = Composite and HDMI | | video = Composite and HDMI | ||
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=== Notable Differences === | === Notable Differences === | ||
* The 45nm [[Valhalla]] CGPU has been replaced with the [[Oban]] CGPU which has the eDRAM integrated into the CGPU die | * The 45nm [[Valhalla]] CGPU has been replaced with the 32nm [[Oban]] CGPU which has the eDRAM integrated into the CGPU die | ||
* All voltage regulation circuits have been drastically simplified with updated components | * All voltage regulation circuits have been drastically simplified with updated components | ||
* [[Nand#ST NAND128W3A2BN6|ST NAND128W3A2BN6]] nand chip is no longer used | * [[Nand#ST NAND128W3A2BN6|ST NAND128W3A2BN6]] nand chip is no longer used | ||
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=== Specifications === | === Specifications === | ||
* IBM/ATi [[Oban]] CGPU with integrated NEC [[eDRAM]] | * 32nm IBM/ATi [[Oban]] CGPU with integrated NEC [[eDRAM]] | ||
* 512MB GDDR3 RAM | * 512MB GDDR3 RAM | ||
** 4x128MB [[Samsung RAM#K4J10324KG-HC14|Samsung K4J10324KG-HC14]] | ** 4x128MB [[Samsung RAM#K4J10324KG-HC14|Samsung K4J10324KG-HC14]] | ||
Revision as of 14:14, 4 April 2024
 4GB SKU | |
| Part Number | X879957 |
|---|---|
| Introduced | Late 2014 |
| Used In | Xbox 360 E |
| CGPU Type | Oban |
| CGPU Process | 32nm |
| Nand Size | 16MB or 4GB |
| Video Outputs | Composite and HDMI |
| Wattage | 120W |
| 12V Amperage | 9.6A |
| Predecessor | Stingray |
Winchester is the successor to Stingray. It is the final motherboard and is used in the Xbox 360 E.
Notable Differences
- The 45nm Valhalla CGPU has been replaced with the 32nm Oban CGPU which has the eDRAM integrated into the CGPU die
- All voltage regulation circuits have been drastically simplified with updated components
- ST NAND128W3A2BN6 nand chip is no longer used
- SK Hynix H26M31002GPR eMMC has been replaced with SK Hynix H26M31001HPR
- Toshiba THGBM5G5A1JBAIR eMMC is no longer used (unconfirmed)
- The board layout has been simplified and cleaned up
- Many unpopulated circuits have been completed removed (such as Audible Feedback)
Specifications
- 32nm IBM/ATi Oban CGPU with integrated NEC eDRAM
- 512MB GDDR3 RAM
- 4x128MB Samsung K4J10324KG-HC14
- 4x128MB Winbond W641GG2KB-14
- KSB Southbridge
- Nand
- 16MB SK Hynix HY27US08281A
- 4GB SK Hynix H26M31001HPR eMMC
- Short Slug Heatsink