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{{Infobox Component
{{Infobox Motherboard
| name        = Xenon
| name        = Xenon
| image        = X803600-011.jpg
| introduced  = Late 2005
| introduced  = Late 2005
| partnumber  = X803600
| partnumber  = X803600
| type        = Motherboard
| usedin      = [[Xbox 360 (Original)]]
| usedin      = [[Xbox 360 (Original)]]
| cputype      = [[Waternoose (CPU)#Waternoose2|Waternoose2]]
| cputype      = [[Waternoose]]
| gputype      = [[Y1 (GPU)|Y1]]
| gputype      = [[Y1 (GPU)|Y1]]
| cpuprocess  = 90nm
| cpuprocess  = 90nm
| gpuprocess  = 90nm
| gpuprocess  = 90nm
| edramprocess = 90nm
| edramprocess = 90nm
| nandsize    = 16MB
| nandsize    = 16MB (Retail)<br>64MB (Dev)
| video        = [[A/V Multi]]
| video        = [[A/V]]
| wattage      = 203W
| wattage      = 203W
| 12vamps      = 16.5A
| 12vamps      = 16.5A
| successor    = [[Zephyr]]
| successor    = [[Zephyr|Zephyr_A]]<br>[[Elpis (Motherboard)|Elpis]]
}}
}}
{{for|the CPU|Xenon (CPU)}}


The '''Xenon''' motherboard is the first final motherboard and is used in the [[Original Xbox 360]] series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the [[ANA]] chip.
'''Xenon''' is the first [[motherboard]] and is used in the [[Original Xbox 360]] series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the [[ANA]] chip. The production board is known as Fab K, which is version -011.


=== Notes ===
=== Notes ===
* At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
* At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU
* Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
* Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
* Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details)
* Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details)
* There are two different versions of the [[XSB]] southbridge used, initially [[XSB#G0|G0]], and later switching to [[XSB#R0|R0]]
* At some point in 2006, the [[Heatsink#Extended GPU| extended]] GPU heatsink started being used on some systems instead of the [[Heatsink#Low Profile GPU|low profile]] GPU heatsink


=== Specifications ===
=== Specifications ===
* 90nm IBM [[Waternoose (CPU)#Waternoose2|Waternoose2]] CPU
* 90nm [[Waternoose#DD2|Waternoose DD2 or DD3]] CPU
* 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm [[eDRAM]]
* 90nm [[Y1 (GPU)|Y1]] GPU/eDRAM
* 512MB (8x64MB) Infineon or Samsung DDR3 RAM
* 512MB GDDR3 RAM
* [[XSB]] Southbridge
** 8x64MB [[Infineon RAM#HYB18H512321AF-13|Infineon/Qimonda HYB18H512321AF-13]]
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]]
* [[XSB]] Southbridge  
* [[ANA]]
* [[ANA]]
* Hynix 16MB Nand
* Nand
* Boardcom or ICS Ethernet PHY
** 16MB [[Nand#Hynix HY27US08281A|Hynix HY27US08281A]] ([[Retail|Retail]])
* Cypress Clock Generator
** 64MB [[Nand#Samsung K9F1208U0B|Samsung K9F1208U0B]] ([[Developer Hardware|Dev]])
* Boardcom or ICS [[Ethernet PHY]]
* [[Backup_Clock_Generator|Cypress Clock Generator]]
* [[Heatsink#Heatpipe CPU|Heatpipe]] CPU Heatsink
* GPU Heatsink
** [[Heatsink#Low Profile GPU|Low Profile]] (Early/Mid Boards)
** [[Heatsink#Extended GPU|Extended]] (Late Boards)


== Variations ==
=== Prototypes ===
{{Main|Xenon (Motherboard)/Prototypes}}
There are 12 major versions of the Xenon motherboard. The production variant is the 11th version, Fab K (-011).
=== Elpis ===
{{Main|Elpis (Motherboard)}}
[[Elpis (Motherboard)|Elpis]] is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the [[Elpis (GPU)|Elpis]] GPU and software differences.
{{Console Components}}
[[Category:Motherboards]]
[[Category:Motherboards]]

Latest revision as of 21:32, 11 August 2024

Xenon
X803600-011.jpg
Part NumberX803600
IntroducedLate 2005
Used InXbox 360 (Original)
CPU TypeWaternoose
GPU TypeY1
CPU Process90nm
GPU Process90nm
eDRAM Process90nm
Nand Size16MB (Retail)
64MB (Dev)
Video OutputsA/V
Wattage203W
12V Amperage16.5A
SuccessorZephyr_A
Elpis
For the CPU, see Xenon (CPU).

Xenon is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip. The production board is known as Fab K, which is version -011.

Notes

  • At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU
  • Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
  • Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
  • There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
  • At some point in 2006, the extended GPU heatsink started being used on some systems instead of the low profile GPU heatsink

Specifications

Variations

Prototypes

Main article: Xenon (Motherboard)/Prototypes

There are 12 major versions of the Xenon motherboard. The production variant is the 11th version, Fab K (-011).

Elpis

Main article: Elpis (Motherboard)

Elpis is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the Elpis GPU and software differences.

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