Xenon (Motherboard): Difference between revisions
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{{Infobox | {{Infobox Motherboard | ||
| name = Xenon | | name = Xenon | ||
| image = X803600-011.jpg | |||
| introduced = Late 2005 | | introduced = Late 2005 | ||
| partnumber = X803600 | | partnumber = X803600 | ||
| usedin = [[Xbox 360 (Original)]] | | usedin = [[Xbox 360 (Original)]] | ||
| cputype = [[ | | cputype = [[Waternoose]] | ||
| gputype = [[Y1 (GPU)|Y1]] | | gputype = [[Y1 (GPU)|Y1]] | ||
| cpuprocess = 90nm | | cpuprocess = 90nm | ||
| gpuprocess = 90nm | | gpuprocess = 90nm | ||
| edramprocess = 90nm | | edramprocess = 90nm | ||
| nandsize = 16MB | | nandsize = 16MB (Retail)<br>64MB (Dev) | ||
| video = [[A/V | | video = [[A/V]] | ||
| wattage = 203W | | wattage = 203W | ||
| 12vamps = 16.5A | | 12vamps = 16.5A | ||
| successor = [[Zephyr]] | | successor = [[Zephyr|Zephyr_A]]<br>[[Elpis (Motherboard)|Elpis]] | ||
}} | }} | ||
{{for|the CPU|Xenon (CPU)}} | |||
'''Xenon''' is the first [[motherboard]] and is used in the [[Original Xbox 360]] series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the [[ANA]] chip. The production board is known as Fab K, which is version -011. | |||
=== Notes === | === Notes === | ||
* At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU | * At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU | ||
* Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors | * Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors | ||
* Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details) | * Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details) | ||
* There are two different versions of the [[XSB]] southbridge used, initially [[XSB#G0|G0]], and later switching to [[XSB#R0|R0]] | |||
* At some point in 2006, the [[Heatsink#Extended GPU| extended]] GPU heatsink started being used on some systems instead of the [[Heatsink#Low Profile GPU|low profile]] GPU heatsink | |||
=== Specifications === | === Specifications === | ||
* 90nm | * 90nm [[Waternoose#DD2|Waternoose DD2 or DD3]] CPU | ||
* 90nm | * 90nm [[Y1 (GPU)|Y1]] GPU/eDRAM | ||
* | * 512MB GDDR3 RAM | ||
* [[XSB]] Southbridge | ** 8x64MB [[Infineon RAM#HYB18H512321AF-13|Infineon/Qimonda HYB18H512321AF-13]] | ||
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]] | |||
* [[XSB]] Southbridge | |||
* [[ANA]] | * [[ANA]] | ||
* Nand | * Nand | ||
* | ** 16MB [[Nand#Hynix HY27US08281A|Hynix HY27US08281A]] ([[Retail|Retail]]) | ||
* | ** 64MB [[Nand#Samsung K9F1208U0B|Samsung K9F1208U0B]] ([[Developer Hardware|Dev]]) | ||
* Boardcom or ICS [[Ethernet PHY]] | |||
* [[Backup_Clock_Generator|Cypress Clock Generator]] | |||
* [[Heatsink#Heatpipe CPU|Heatpipe]] CPU Heatsink | |||
* GPU Heatsink | |||
** [[Heatsink#Low Profile GPU|Low Profile]] (Early/Mid Boards) | |||
** [[Heatsink#Extended GPU|Extended]] (Late Boards) | |||
== Variations == | |||
=== Prototypes === | |||
{{Main|Xenon (Motherboard)/Prototypes}} | |||
There are 12 major versions of the Xenon motherboard. The production variant is the 11th version, Fab K (-011). | |||
=== Elpis === | |||
{{Main|Elpis (Motherboard)}} | |||
[[Elpis (Motherboard)|Elpis]] is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the [[Elpis (GPU)|Elpis]] GPU and software differences. | |||
{{Console Components}} | |||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Latest revision as of 21:32, 11 August 2024
 | |
| Part Number | X803600 |
|---|---|
| Introduced | Late 2005 |
| Used In | Xbox 360 (Original) |
| CPU Type | Waternoose |
| GPU Type | Y1 |
| CPU Process | 90nm |
| GPU Process | 90nm |
| eDRAM Process | 90nm |
| Nand Size | 16MB (Retail) 64MB (Dev) |
| Video Outputs | A/V |
| Wattage | 203W |
| 12V Amperage | 16.5A |
| Successor | Zephyr_A Elpis |
Xenon is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip. The production board is known as Fab K, which is version -011.
Notes
- At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
- There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
- At some point in 2006, the extended GPU heatsink started being used on some systems instead of the low profile GPU heatsink
Specifications
- 90nm Waternoose DD2 or DD3 CPU
- 90nm Y1 GPU/eDRAM
- 512MB GDDR3 RAM
- 8x64MB Infineon/Qimonda HYB18H512321AF-13
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- Nand
- 16MB Hynix HY27US08281A (Retail)
- 64MB Samsung K9F1208U0B (Dev)
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator
- Heatpipe CPU Heatsink
- GPU Heatsink
- Low Profile (Early/Mid Boards)
- Extended (Late Boards)
Variations
Prototypes
There are 12 major versions of the Xenon motherboard. The production variant is the 11th version, Fab K (-011).
Elpis
Elpis is a modified Xenon used for refurbishing defective Xenon based systems. Major changes include use of the Elpis GPU and software differences.