Stingray: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
Line 17: | Line 17: | ||
}} | }} | ||
'''Stingray''' is the successor to [[Waitsburg]] and is the first motherboard used in the [[Xbox 360 E]]. It is considered a revision of [[Corona]] despite having its own name. | '''Stingray''' is the successor to [[Waitsburg]] and is the first [[motherboard]] used in the [[Xbox 360 E]]. It is considered a revision of [[Corona]] despite having its own name. | ||
Commonly referred to by the community (but not by Microsoft) as the "Corona V5" (16MB) and "Corona V6" (4GB). | Commonly referred to by the community (but not by Microsoft) as the "Corona V5" (16MB) and "Corona V6" (4GB). |
Revision as of 13:36, 5 June 2023
Part Number | X854326 |
---|---|
Introduced | Mid 2013 |
Used In | Xbox 360 E |
CGPU Type | Valhalla |
CGPU Process | 45nm |
eDRAM Process | 65nm |
Nand Size | 16MB or 4GB |
Video Outputs | Composite and HDMI |
Wattage | 120W |
12V Amperage | 9.6A |
Predecessor | Waitsburg |
Successor | Winchester |
Stingray is the successor to Waitsburg and is the first motherboard used in the Xbox 360 E. It is considered a revision of Corona despite having its own name.
Commonly referred to by the community (but not by Microsoft) as the "Corona V5" (16MB) and "Corona V6" (4GB).
Notable Differences
- Winbond W641GG2JB-14 RAM has been replaced with Winbond W641GG2KB-14 (Rreferred to by the community as WB2K)
- Samsung K4J10324KE-HC14 RAM has been replaced with Samsung K4J10324KG-HC14
- Hynix H26M31001FPR eMMC on 4GB SKUs has been replaced with the SK Hynix H26M31002GPR
- Toshiba THGBM5G5A1JBAIR eMMC was added as an option on 4GB SKUs
- The A/V port and most of its circuitry have been removed and replaced by composite video out
- The DC jack has been revised to a single barrel
- The rear triple USB port has been reduced to a dual USB port
- SPDIF has been removed from the rear I/O
- The rotation sensor has been removed, but the traces and pads are still present
- Audible Feedback has been removed, but the traces and pads are still present
- The 1575 RF board is now used
- Minor board layout changes
Specifications
- 45nm IBM/ATi Valhalla CGPU with integrated 65nm NEC eDRAM
- 512MB GDDR3 RAM
- 4x128MB Samsung K4J10324KG-HC14
- 4x128MB Winbond W641GG2KB-14
- KSB Southbridge
- Nand
- 16MB SK Hynix HY27US08281A
- 16MB ST NAND128W3A2BN6
- 4GB SK Hynix H26M31002GPR eMMC
- 4GB Toshiba THGBM5G5A1JBAIR eMMC
- Short Slug Heatsink