Xenon (Motherboard): Difference between revisions

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* 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm NEC [[eDRAM]]
* 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm NEC [[eDRAM]]
* 512MB GDDR3 RAM
* 512MB GDDR3 RAM
** 8x64MB [[Qimonda RAM#HYB18H512321AF-13|Infineon HYB18H512321AF-13]]
** 8x64MB [[Infineon RAM#HYB18H512321AF-13|Infineon HYB18H512321AF-13]]
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]]
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]]
* [[XSB]] Southbridge  
* [[XSB]] Southbridge  

Revision as of 22:55, 3 January 2023

Xenon
Part NumberX803600
IntroducedLate 2005
TypeMotherboard
Used InXbox 360 (Original)
CPU TypeWaternoose
GPU TypeY1
CPU Process90nm
GPU Process90nm
eDRAM Process90nm
Nand Size16MB (Retail)
64MB (Dev)
Video OutputsA/V
Wattage203W
12V Amperage16.5A
SuccessorZephyr_A
For the CPU, see Xenon (CPU).

The Xenon motherboard is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.

Notes

  • At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
  • Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
  • Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
  • There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
  • At some point in 2006, the extended GPU heatsink started being used instead of the low profile GPU heatsink

Specifications

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