Xenon (Motherboard): Difference between revisions

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| type        = Motherboard
| type        = Motherboard
| usedin      = [[Xbox 360 (Original)]]
| usedin      = [[Xbox 360 (Original)]]
| cputype      = [[Waternoose (CPU)#Waternoose2|Waternoose2]]
| cputype      = [[Waternoose (CPU)#DD2.0|Waternoose DD2.x]]
| gputype      = [[Y1 (GPU)|Y1]]
| gputype      = [[Y1 (GPU)|Y1]]
| cpuprocess  = 90nm
| cpuprocess  = 90nm

Revision as of 20:43, 26 December 2022

Xenon
Part NumberX803600
IntroducedLate 2005
TypeMotherboard
Used InXbox 360 (Original)
CPU TypeWaternoose DD2.x
GPU TypeY1
CPU Process90nm
GPU Process90nm
eDRAM Process90nm
Nand Size16MB
Video OutputsA/V Multi
Wattage203W
12V Amperage16.5A
SuccessorZephyr_A

The Xenon motherboard is the first motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.

Notes

  • At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
  • Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
  • Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
  • There are two different versions of the XSB southbridge used, initially G0, and later switching to R0
  • At some point in 2006, the extended GPU heatsink started being used instead of the low profile GPU heatsink

Specifications