Tonasket: Difference between revisions

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'''Tonasket''' is the successor to the [[Jasper]], and is the final motherboard used in the [[Original Xbox 360]] series. It is considered a revision of Jasper despite having its own name.
'''Tonasket''', initially known as '''Jasper_B''', is the successor to the [[Jasper|Jasper_A1]] [[motherboard]], and is the final [[motherboard]] used in the [[Original Xbox 360]] series.


Commonly referred to by the community (but not by Microsoft) as "Kronos", a reference to the GPU used.
Commonly referred to by the community (but not by Microsoft) as "Kronos", a reference to the GPU used.


=== Notable Differences ===
=== Notable Differences ===
* The 65nm [[Zeus]] GPU has been replaced with the 65nm [[Kronos]] GPU, which shrinks the [[eDRAM]] to 65nm
* The [[Zeus]] GPU has been replaced with the [[Kronos]] GPU
* [[Samsung RAM#K4J10324QD-HC14|Samsung K4J10324QD-HC14]] RAM was added as an option
* [[Samsung RAM#K4J10324QD-HC14|Samsung K4J10324QD-HC14]] RAM was added as an option
* [[Hynix RAM#H5RS5223CFR-14C|Hynix H5RS5223CFR-14C]] RAM is no longer used
* [[Hynix RAM#H5RS5223CFR-14C|Hynix H5RS5223CFR-14C]] RAM is no longer used
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* An alternate simplified standby circuit for [[Power Rails#V_3P3STBY|V_3P3STBY]] and [[Power Rails#V_1P8STBY|V_1P8STBY]] was added, but only some manufacturers used it
* An alternate simplified standby circuit for [[Power Rails#V_3P3STBY|V_3P3STBY]] and [[Power Rails#V_1P8STBY|V_1P8STBY]] was added, but only some manufacturers used it
* The board layout was cleaned up
* The board layout was cleaned up
* All motherboards use an updated [[RF Board#RF02|RF02]] board
* All motherboards use the updated [[RF Board#RF02|RF02]] board
* The [[Heatsinks#Extended GPU| extended]] GPU heatsink was reverted back to the [[Heatsinks#Low Profile GPU|low profile]] GPU heatsink
* The [[Heatsink#Extended GPU| extended]] GPU heatsink was reverted back to the [[Heatsink#Low Profile GPU|low profile]] GPU heatsink
* All boards now use solid state capacitors for the CPU and GPU output filters
* All boards now use solid state capacitors for the CPU and GPU output filters
* There is no longer glue applied around the CPU and GPU
* There is no longer glue applied around the CPU and GPU


=== Specifications ===
=== Specifications ===
* 65nm IBM [[Loki]] CPU
* 65nm [[Loki]] CPU
* 65nm ATi [[Kronos]] GPU with integrated 65nm NEC [[eDRAM]]
* 65nm [[Kronos]] GPU/eDRAM
* 512MB GDDR3 RAM
* 512MB GDDR3 RAM
** 4x128MB [[Hynix RAM#H5RS1H23MFR-14C|Hynix H5RS1H23MFR-14C]]
** 4x128MB [[Hynix RAM#H5RS1H23MFR-14C|Hynix H5RS1H23MFR-14C]]
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** 512MB [[Nand#Hynix HY27UF084G2B|Hynix HY27UF084G2B]]
** 512MB [[Nand#Hynix HY27UF084G2B|Hynix HY27UF084G2B]]
** 512MB [[Nand#Samsung K9F4G08U0B|Samsung K9F4G08U0B]]
** 512MB [[Nand#Samsung K9F4G08U0B|Samsung K9F4G08U0B]]
* Boardcom or ICS Ethernet PHY
* Boardcom or ICS [[Ethernet PHY]]
* [[Heatsinks#Aluminum CPU|Aluminum]] CPU Heatsink
* [[Heatsink#Aluminum CPU|Aluminum]] CPU Heatsink
* [[Heatsinks#Low Profile GPU|Low Profile]] GPU Heatsink
* [[Heatsink#Low Profile GPU|Low Profile]] GPU Heatsink


{{Console Components}}
{{Console Components}}
[[Category:Motherboards]]
[[Category:Motherboards]]

Latest revision as of 23:26, 6 April 2024

Tonasket
X820379-001.jpg
Part NumberX820379
IntroducedLate 2009
Used InXbox 360 (Original)
CPU TypeLoki
GPU TypeKronos
CPU Process65nm
GPU Process65nm
eDRAM Process65nm
Nand Size16MB, 512MB
Video OutputsA/V and HDMI
Wattage150W
12V Amperage12.1A
PredecessorJasper
SuccessorTrinity

Tonasket, initially known as Jasper_B, is the successor to the Jasper_A1 motherboard, and is the final motherboard used in the Original Xbox 360 series.

Commonly referred to by the community (but not by Microsoft) as "Kronos", a reference to the GPU used.

Notable Differences

  • The Zeus GPU has been replaced with the Kronos GPU
  • Samsung K4J10324QD-HC14 RAM was added as an option
  • Hynix H5RS5223CFR-14C RAM is no longer used
  • 8x64MB RAM configurations are no longer used, but still supported by the motherboard
  • The 256MB nand chip was no longer used, only 512MB configurations were used in the Arcade SKU
  • The additional traces and pads for DUMBO/PANDA flash controller were removed
  • An alternate simplified standby circuit for V_3P3STBY and V_1P8STBY was added, but only some manufacturers used it
  • The board layout was cleaned up
  • All motherboards use the updated RF02 board
  • The extended GPU heatsink was reverted back to the low profile GPU heatsink
  • All boards now use solid state capacitors for the CPU and GPU output filters
  • There is no longer glue applied around the CPU and GPU

Specifications