Tonasket: Difference between revisions
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| introduced = Late 2009 | | introduced = Late 2009 | ||
| partnumber = X820379 | | partnumber = X820379 | ||
| usedin = [[Xbox 360 (Original)]] | | usedin = [[Xbox 360 (Original)]] | ||
| cputype = [[ | | cputype = [[Loki]] | ||
| gputype = [[ | | gputype = [[Kronos]] | ||
| cpuprocess = 65nm | | cpuprocess = 65nm | ||
| gpuprocess = 65nm | | gpuprocess = 65nm | ||
Line 19: | Line 18: | ||
}} | }} | ||
'''Tonasket''' is the successor to the [[ | '''Tonasket''', initially known as '''Jasper_B''', is the successor to the [[Jasper|Jasper_A1]] [[motherboard]], and is the final [[motherboard]] used in the [[Original Xbox 360]] series. | ||
Commonly referred to by the community (but not by Microsoft) as "Kronos". | Commonly referred to by the community (but not by Microsoft) as "Kronos", a reference to the GPU used. | ||
=== Notable Differences === | === Notable Differences === | ||
* The | * The [[Zeus]] GPU has been replaced with the [[Kronos]] GPU | ||
* [[Samsung RAM#K4J10324QD-HC14|Samsung K4J10324QD-HC14]] RAM was added as an option | * [[Samsung RAM#K4J10324QD-HC14|Samsung K4J10324QD-HC14]] RAM was added as an option | ||
* [[Hynix RAM#H5RS5223CFR-14C|Hynix H5RS5223CFR-14C]] RAM is no longer used | * [[Hynix RAM#H5RS5223CFR-14C|Hynix H5RS5223CFR-14C]] RAM is no longer used | ||
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* An alternate simplified standby circuit for [[Power Rails#V_3P3STBY|V_3P3STBY]] and [[Power Rails#V_1P8STBY|V_1P8STBY]] was added, but only some manufacturers used it | * An alternate simplified standby circuit for [[Power Rails#V_3P3STBY|V_3P3STBY]] and [[Power Rails#V_1P8STBY|V_1P8STBY]] was added, but only some manufacturers used it | ||
* The board layout was cleaned up | * The board layout was cleaned up | ||
* All motherboards use | * All motherboards use the updated [[RF Board#RF02|RF02]] board | ||
* The [[ | * The [[Heatsink#Extended GPU| extended]] GPU heatsink was reverted back to the [[Heatsink#Low Profile GPU|low profile]] GPU heatsink | ||
* All boards now use solid state capacitors for the CPU and GPU output filters | * All boards now use solid state capacitors for the CPU and GPU output filters | ||
* There is no longer glue applied around the CPU and GPU | * There is no longer glue applied around the CPU and GPU | ||
=== Specifications === | === Specifications === | ||
* 65nm | * 65nm [[Loki]] CPU | ||
* 65nm | * 65nm [[Kronos]] GPU/eDRAM | ||
* 512MB GDDR3 RAM | * 512MB GDDR3 RAM | ||
** 4x128MB [[Hynix RAM#H5RS1H23MFR-14C|Hynix H5RS1H23MFR-14C]] | ** 4x128MB [[Hynix RAM#H5RS1H23MFR-14C|Hynix H5RS1H23MFR-14C]] | ||
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** 512MB [[Nand#Hynix HY27UF084G2B|Hynix HY27UF084G2B]] | ** 512MB [[Nand#Hynix HY27UF084G2B|Hynix HY27UF084G2B]] | ||
** 512MB [[Nand#Samsung K9F4G08U0B|Samsung K9F4G08U0B]] | ** 512MB [[Nand#Samsung K9F4G08U0B|Samsung K9F4G08U0B]] | ||
* Boardcom or ICS Ethernet PHY | * Boardcom or ICS [[Ethernet PHY]] | ||
* [[ | * [[Heatsink#Aluminum CPU|Aluminum]] CPU Heatsink | ||
* [[ | * [[Heatsink#Low Profile GPU|Low Profile]] GPU Heatsink | ||
{{Console Components}} | {{Console Components}} | ||
[[Category:Motherboards]] | [[Category:Motherboards]] |
Latest revision as of 23:26, 6 April 2024
Part Number | X820379 |
---|---|
Introduced | Late 2009 |
Used In | Xbox 360 (Original) |
CPU Type | Loki |
GPU Type | Kronos |
CPU Process | 65nm |
GPU Process | 65nm |
eDRAM Process | 65nm |
Nand Size | 16MB, 512MB |
Video Outputs | A/V and HDMI |
Wattage | 150W |
12V Amperage | 12.1A |
Predecessor | Jasper |
Successor | Trinity |
Tonasket, initially known as Jasper_B, is the successor to the Jasper_A1 motherboard, and is the final motherboard used in the Original Xbox 360 series.
Commonly referred to by the community (but not by Microsoft) as "Kronos", a reference to the GPU used.
Notable Differences
- The Zeus GPU has been replaced with the Kronos GPU
- Samsung K4J10324QD-HC14 RAM was added as an option
- Hynix H5RS5223CFR-14C RAM is no longer used
- 8x64MB RAM configurations are no longer used, but still supported by the motherboard
- The 256MB nand chip was no longer used, only 512MB configurations were used in the Arcade SKU
- The additional traces and pads for DUMBO/PANDA flash controller were removed
- An alternate simplified standby circuit for V_3P3STBY and V_1P8STBY was added, but only some manufacturers used it
- The board layout was cleaned up
- All motherboards use the updated RF02 board
- The extended GPU heatsink was reverted back to the low profile GPU heatsink
- All boards now use solid state capacitors for the CPU and GPU output filters
- There is no longer glue applied around the CPU and GPU
Specifications
- 65nm Loki CPU
- 65nm Kronos GPU/eDRAM
- 512MB GDDR3 RAM
- 4x128MB Hynix H5RS1H23MFR-14C
- 4x128MB Qimonda HYB18H1G321AF-14
- 4x128MB Samsung K4J10324QD-HC14
- PSB Southbridge
- HANA
- Nand
- 16MB Hynix HY27US08281A
- 512MB Hynix HY27UF084G2B
- 512MB Samsung K9F4G08U0B
- Boardcom or ICS Ethernet PHY
- Aluminum CPU Heatsink
- Low Profile GPU Heatsink