Stingray: Difference between revisions
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| partnumber = X854326 | | partnumber = X854326 | ||
| usedin = [[Xbox 360 E]] | | usedin = [[Xbox 360 E]] | ||
| cgputype = [[ | | cgputype = [[Vejle]] | ||
| cgpuprocess = 45nm | | cgpuprocess = 45nm | ||
| edramprocess = 65nm | | edramprocess = 65nm | ||
| Line 36: | Line 36: | ||
=== Specifications === | === Specifications === | ||
* 45nm | * 45nm [[Vejle]] CGPU with 65nm eDRAM | ||
* 512MB GDDR3 RAM | * 512MB GDDR3 RAM | ||
** 4x128MB [[Samsung RAM#K4J10324KG-HC14|Samsung K4J10324KG-HC14]] | ** 4x128MB [[Samsung RAM#K4J10324KG-HC14|Samsung K4J10324KG-HC14]] | ||
Latest revision as of 23:48, 7 April 2024
 4GB SKU | |
| Part Number | X854326 |
|---|---|
| Introduced | Mid 2013 |
| Used In | Xbox 360 E |
| CGPU Type | Vejle |
| CGPU Process | 45nm |
| eDRAM Process | 65nm |
| Nand Size | 16MB or 4GB |
| Video Outputs | Composite and HDMI |
| Wattage | 120W |
| 12V Amperage | 9.6A |
| Predecessor | Waitsburg |
| Successor | Winchester |
Stingray is the successor to Waitsburg and is the first motherboard used in the Xbox 360 E. It is considered a revision of Corona despite having its own name.
Commonly referred to by the community (but not by Microsoft) as the "Corona V5" (16MB) and "Corona V6" (4GB).
Notable Differences
- Winbond W641GG2JB-14 RAM has been replaced with Winbond W641GG2KB-14 (Rreferred to by the community as WB2K)
- Samsung K4J10324KE-HC14 RAM has been replaced with Samsung K4J10324KG-HC14
- Hynix H5RS1H23MFR-14C RAM is no longer used
- Hynix H26M31001FPR eMMC on 4GB SKUs has been replaced with the SK Hynix H26M31002GPR
- Toshiba THGBM5G5A1JBAIR eMMC was added as an option on 4GB SKUs
- The A/V port and most of its circuitry have been removed and replaced by composite video out
- The DC jack has been revised to a single barrel
- The rear triple USB port has been reduced to a dual USB port
- SPDIF has been removed from the rear I/O
- The rotation sensor has been removed, but the traces and pads are still present
- Audible Feedback has been removed, but the traces and pads are still present
- The 1575 RF board is now used
Specifications
- 45nm Vejle CGPU with 65nm eDRAM
- 512MB GDDR3 RAM
- 4x128MB Samsung K4J10324KG-HC14
- 4x128MB Winbond W641GG2KB-14
- KSB Southbridge
- Nand
- 16MB SK Hynix HY27US08281A
- 16MB ST NAND128W3A2BN6
- 4GB SK Hynix H26M31002GPR eMMC
- 4GB Toshiba THGBM5G5A1JBAIR eMMC
- Short Slug Heatsink