XCPU: Difference between revisions

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| codename    = Xenon
| codename    = Xenon
| type        = CPU
| type        = CPU
| usedin      = [[Xbox 360]]
| usedin      = [[Original Xbox 360]]
| clockspeed  = 3.2GHz
| clockspeed  = 3.2GHz
| cache        = L1: 32KB/32KB<br>L2: 1MB
| cache        = L1: 32KB/32KB<br>L2: 1MB

Revision as of 20:34, 21 December 2022

XCPU
File:X02046.jpg
The original XCPU, Waternoose
Introduced2005
Designed ByIBM
Microsoft
CodenameXenon
TypeCPU
Used InOriginal Xbox 360
Clock Speed3.2GHz
CacheL1: 32KB/32KB
L2: 1MB
Instruction SetPowerPC RISC
Cores3
Threads6

The Microsoft XCPU, codenamed Xenon, is the central processor used in the Xbox 360 game console. It is designed to be used with the ATi Xenos graphics chip, which also functions as the northbridge and memory controller.

The processor was developed by Microsoft and IBM, and the first version was codenamed Waternoose after the fictional character Henry J. Waternoose III.

Specifications

  • 3 two-way SMD-capable RISC cores clocked at 3.2GHz
  • SIMD: Two VMX128 units
  • 32KB L1 data cache
  • 32KB L1 instruction cache
  • 1MB L2 cache at 1.6 GHz with a 256-bit bus
  • 21.6GB/s FSB
  • 768 bits of IBM eFUSE one-time-program memory
  • ROM and 64KB SRAM for storing the 1BL
  • Big-endian architecture

Versions

Multiple versions of the XCPU have been created for different motherboard types

90nm

The initial version of the XCPU, codename Waternoose, entered production in 2005 and is used on the Xenon and Zephyr motherboards. It is notable for being quite power hungry.

65nm

In 2007, the XCPU was shrunk and slightly redesigned for the 65nm process. Codename Loki, it is used on the Falcon and Jasper motherboards. It is notable for having significantly lower power and thermal requirements.

45nm (XCGPU)

In 2010, the XCPU was shrunk to the 45nm process and combined with the Xenos graphics chip to create a system-on-a-chip, called the XCGPU. The eDRAM remains on a separate die and an IHS was added. Codename Valhalla, it is used on the Trinity and Corona motherboards.

Winchester

In 2014, the XCGPU process was shrunk by an unknown amount and the eDRAM die was integrated into the CGPU die. The codename and specifics for this chip are unknown. The single die design meant that the IHS was no longer needed. It is used on the Winchester motherboard and is notable for patching the RGH exploit.