GPU
 The original Xenos, Y1 | |
| Introduced | Late 2005 |
|---|---|
| Designed By | ATi Microsoft NEC (eDRAM) |
| Type | GPU |
| Used In | Original Xbox 360 |
| Clock Speed | 500MHz |
| Memory | 10MB eDRAM |
| Successor | XCGPU |
Xenos is the graphics processor, northbridge, and memory controller used in the Xbox 360.
The processor was developed by Microsoft and ATi, and the first version was codenamed Y1, which stands for Year 1.
It also contained an eDRAM daughter die that contains additional logic. The eDRAM was designed by NEC.
GPU Specifications
- 500Mhz clock speed
- 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
- Unified shader architecture
- 16 texture addressing units
- 16 texture filtering units
- 8 pixel rendering pipelines
- Direct access to CPU L2 cache
GPU Variants
Y1 (90nm)
The initial version of Xenos, known as Y1, entered production in 2005 and is used on the Xenon and Zephyr_A motherboards. Initial versions were defective while later versions became reliable.
Y2 (80nm)
In 2007, Xenos was shrunk to 80nm, while the eDRAM remained at 90nm. Known as Y2, it is used on the Zephyr_B motherboard.
Rhea (80nm)
Later in 2007, The Y2 version of Xenos was revised with an 80nm eDRAM. Known as Rhea, it is used on the Zephyr_C and Falcon motherboards. Later versions of the chip were the first chips installed on newly produced consoles to be reliable. Multiple versions of Rhea were created as Microsoft experimentated during the attempts to make the chip reliable.
Elpis (80nm)
In 2009, fixed 90nm Xenos chips stopped being produced, however Microsoft still had Xenons to repair and refurbish. Since the fixed 80nm Rhea chip was still being produced, Microsoft chose to slightly modify it in order to allow an 80nm chip to be retrofitted in place of a defective 90nm chip. This modification to Xenon boards was known as Elpis, which served as the name of the GPU and the motherboard with this GPU installed.
Zeus (65nm)
In 2008, Xenos was redesigned for the 65nm process. The eDRAM remained at 80nm. Known as Zeus, it is used on the Jasper motherboard. It is the first chip where all variants are reliable.
Kronos (65nm)
In 2009, the Zeus version of Xenos was revised with n 65nm eDRAM. Known as Kronos, it is used on the Jasper (July 2009 only) and Tonasket motherboards.
XCGPU (45nm)
In 2010, Xenos was shrunk to the 45nm process and combined with the XCPU to create a system-on-a-chip, called the XCGPU.
eDRAM Specifications
- 10MB 256GB/s eDRAM
- Contains logic for:
- 4-sample anti-aliasing
- Alpha compositing
- Color
- Z/stencil buffering
eDRAM Variants
Edifis
Edifis is the first eDRAM die used on Xenos. It was only manufactured on the 90nm process. It was used on the initial version of Y1 and Y2.
Styx
Styx is the redesigned eDRAM die and replaces Edifis. It was manufactured on the 90nm, 80nm, and 65nm processes. It was used on later versions of Y1 and Y2, as well as on all versions of Rhea, Elpis, Zeus, and Kronos. It was also used on the Valhalla XCGPU.
Winchester CGPU
The Winchester CGPU integrated the eDRAM into the main die. As a result, there is no daughter die anymore.