XSB: Difference between revisions

From XenonLibrary
Jump to navigation Jump to search
No edit summary
 
(18 intermediate revisions by 2 users not shown)
Line 8: Line 8:
| caption2    = XSB R0
| caption2    = XSB R0
| partnumber  = X02047
| partnumber  = X02047
| introduced  = 2005
| introduced  = Late 2005
| designedby  = Microsoft<br>SiS
| designedby  = Microsoft<br>SiS
| codename    = Xenon SB
| type        = [[Southbridge]]
| type        = [[Southbridge]]
| usedin      = [[Xenon (Motherboard)|Xenon]]<br>[[Zephyr]]<br>[[Falcon]]
| usedin      = [[Xenon (Motherboard)|Xenon]]<br>[[Zephyr]]<br>[[Falcon]]<br>[[Jasper#Jasper_A0|Jasper_A0]]
| process      = 150nm
| process      = 150nm
| tdp          = 3.2W
| tdp          = 3.2W
| package      = Flip-chip BGA382
| package      = Flip-chip BGA382
| successor    = [[Loki (CPU)|Loki]]
| successor    = [[PSB]]
}}
}}


'''XSB''' is the first [[Southbridge]] used in the [[Xbox 360]].
'''XSB''' (Xenon SB) is the first [[southbridge]] and are used on [[Xenon (Motherboard)|Xenon]], [[Zephyr]], [[Falcon]], and [[Jasper#Jasper A0|Jasper_A0]] motherboards. There are 2 production [[stepping]]s, G0 and R0. R0 fixes some minor issues.
 
== Specifications ==
{{Southbridge Specs}}
* G0 or R0 [[stepping]]
* 150nm process
* 3.2W TDP
 
== Details ==
* Part Number: X02047
 
== Prototypes ==
Engineering Samples by [[stepping]].
 
=== E2 ===
[[File:X02047-011.jpg|150px]]
 
* Part Number: X02047-011
 
=== G0 ===
Engineering sample for the final G0 production chip.
 
[[File:X02047-012-ES.jpg|150px]]
[[File:X02047-012-ES-2.jpg|150px]]
 
* Part Number: X02047-012
 
{{Motherboard Components}}
[[Category:Motherboard Components]]

Latest revision as of 23:21, 1 August 2024

XSB
X02047-012.jpg
XSB G0
X02047-027.jpg
XSB R0
Part NumberX02047
IntroducedLate 2005
Designed ByMicrosoft
SiS
CodenameXenon SB
TypeSouthbridge
Used InXenon
Zephyr
Falcon
Jasper_A0
Process150nm
TDP3.2W
PackageFlip-chip BGA382
SuccessorPSB

XSB (Xenon SB) is the first southbridge and are used on Xenon, Zephyr, Falcon, and Jasper_A0 motherboards. There are 2 production steppings, G0 and R0. R0 fixes some minor issues.

Specifications

  • Intel 8051 processor core (SMC)
  • PCI-Express x2 interface (for the BSB)
  • Serial-ATA (SATA) interface
  • USB1.1/2.0 interface
  • IR interface
  • Wireless game controller interface (for the RF Board)
  • WMA Pro audio hardware
  • Nand flash interface
  • Ethernet Media Access Controller (MAC)
  • G0 or R0 stepping
  • 150nm process
  • 3.2W TDP

Details

  • Part Number: X02047

Prototypes

Engineering Samples by stepping.

E2

X02047-011.jpg

  • Part Number: X02047-011

G0

Engineering sample for the final G0 production chip.

X02047-012-ES.jpg X02047-012-ES-2.jpg

  • Part Number: X02047-012