XSB: Difference between revisions
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== Details == | == Details == | ||
* Part Number: X02047 | * Part Number: X02047 | ||
== Prototypes == | |||
Engineering Samples by [[stepping]]. | |||
=== E2 === | |||
[[File:X02047-011.jpg|150px]] | |||
* Part Number: X02047-011 | |||
=== G0 === | |||
Engineering sample for the final G0 production chip. | |||
[[File:X02047-012-ES.jpg|150px]] | |||
[[File:X02047-012-ES-2.jpg|150px]] | |||
* Part Number: X02047-012 | |||
{{Motherboard Components}} | {{Motherboard Components}} | ||
[[Category:Motherboard Components]] | [[Category:Motherboard Components]] |
Latest revision as of 00:21, 2 August 2024
Part Number | X02047 |
---|---|
Introduced | Late 2005 |
Designed By | Microsoft SiS |
Codename | Xenon SB |
Type | Southbridge |
Used In | Xenon Zephyr Falcon Jasper_A0 |
Process | 150nm |
TDP | 3.2W |
Package | Flip-chip BGA382 |
Successor | PSB |
XSB (Xenon SB) is the first southbridge and are used on Xenon, Zephyr, Falcon, and Jasper_A0 motherboards. There are 2 production steppings, G0 and R0. R0 fixes some minor issues.
Specifications
- Intel 8051 processor core (SMC)
- PCI-Express x2 interface (for the BSB)
- Serial-ATA (SATA) interface
- USB1.1/2.0 interface
- IR interface
- Wireless game controller interface (for the RF Board)
- WMA Pro audio hardware
- Nand flash interface
- Ethernet Media Access Controller (MAC)
- G0 or R0 stepping
- 150nm process
- 3.2W TDP
Details
- Part Number: X02047
Prototypes
Engineering Samples by stepping.
E2
- Part Number: X02047-011
G0
Engineering sample for the final G0 production chip.
- Part Number: X02047-012