XSB: Difference between revisions
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| introduced = Late 2005 | | introduced = Late 2005 | ||
| designedby = Microsoft<br>SiS | | designedby = Microsoft<br>SiS | ||
| codename = Xenon SB | |||
| type = [[Southbridge]] | | type = [[Southbridge]] | ||
| usedin = [[Xenon (Motherboard)|Xenon]]<br>[[Zephyr]]<br>[[Falcon]] | | usedin = [[Xenon (Motherboard)|Xenon]]<br>[[Zephyr]]<br>[[Falcon]]<br>[[Jasper#Jasper_A0|Jasper_A0]] | ||
| process = 150nm | | process = 150nm | ||
| tdp = 3.2W | | tdp = 3.2W | ||
| Line 18: | Line 19: | ||
}} | }} | ||
'''XSB''' is the first [[ | '''XSB''' (Xenon SB) is the first [[southbridge]] and are used on [[Xenon (Motherboard)|Xenon]], [[Zephyr]], [[Falcon]], and [[Jasper#Jasper A0|Jasper_A0]] motherboards. There are 2 production [[stepping]]s, G0 and R0. R0 fixes some minor issues. | ||
== Specifications == | == Specifications == | ||
{{Southbridge Specs}} | {{Southbridge Specs}} | ||
* G0 or R0 [[stepping]] | |||
* 150nm process | * 150nm process | ||
* 3.2W TDP | * 3.2W TDP | ||
| Line 27: | Line 29: | ||
== Details == | == Details == | ||
* Part Number: X02047 | * Part Number: X02047 | ||
== Prototypes == | |||
Engineering Samples by [[stepping]]. | |||
=== E2 === | |||
[[File:X02047-011.jpg|150px]] | |||
* Part Number: X02047-011 | |||
=== G0 === | |||
Engineering sample for the final G0 production chip. | |||
[[File:X02047-012-ES.jpg|150px]] | |||
[[File:X02047-012-ES-2.jpg|150px]] | |||
* Part Number: X02047-012 | |||
{{Motherboard Components}} | {{Motherboard Components}} | ||
[[Category:Motherboard Components]] | [[Category:Motherboard Components]] | ||
Latest revision as of 00:21, 2 August 2024
 XSB G0 | |
 XSB R0 | |
| Part Number | X02047 |
|---|---|
| Introduced | Late 2005 |
| Designed By | Microsoft SiS |
| Codename | Xenon SB |
| Type | Southbridge |
| Used In | Xenon Zephyr Falcon Jasper_A0 |
| Process | 150nm |
| TDP | 3.2W |
| Package | Flip-chip BGA382 |
| Successor | PSB |
XSB (Xenon SB) is the first southbridge and are used on Xenon, Zephyr, Falcon, and Jasper_A0 motherboards. There are 2 production steppings, G0 and R0. R0 fixes some minor issues.
Specifications
- Intel 8051 processor core (SMC)
- PCI-Express x2 interface (for the BSB)
- Serial-ATA (SATA) interface
- USB1.1/2.0 interface
- IR interface
- Wireless game controller interface (for the RF Board)
- WMA Pro audio hardware
- Nand flash interface
- Ethernet Media Access Controller (MAC)
- G0 or R0 stepping
- 150nm process
- 3.2W TDP
Details
- Part Number: X02047
Prototypes
Engineering Samples by stepping.
E2
- Part Number: X02047-011
G0
Engineering sample for the final G0 production chip.
- Part Number: X02047-012