Elpis (GPU): Difference between revisions

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== Details ==
== Details ==
The only known change to [[Rhea (GPU)|Rhea]] to create Elpis was swizzling (flipping) the PCIe balls on the chip in order to match the ballout of the original 90nm [[Y1 (GPU)|Y1]] chip it replaces. These chips are known to be reliable.
The only known change from [[Rhea (GPU)|Rhea]] to create Elpis was swizzling (flipping) the PCIe balls on the chip in order to match the ballout of the original 90nm [[Y1 (GPU)|Y1]] chip it replaces. These chips are known to be reliable.


* Part Number: X819195
* Part Number: X819195

Revision as of 12:35, 17 January 2023

Elpis (GPU)
X819195-002.jpg
Part NumberX819195
IntroducedMid 2009
Designed ByATi
Microsoft
NEC (eDRAM)
CodenameC2
TypeGPU
Used InElpis (Motherboard)
Clock Speed500MHz
Memory10MB eDRAM
Process80nm (Both dies)
PackageFlip-chip BGA1017
PredecessorY1

Elpis is an 80nm GPU specifically made for retrofitting faulty Xenon motherboard Xbox 360 consoles. Once retrofitted, the motherboard is referred to as Elpis (Motherboard). The Elpis GPU was created by slightly modifying the fixed version of the Rhea GPU and has the B14L design.

Specifications

GPU

  • 500Mhz clock speed
  • 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
  • Unified shader architecture
  • 16 texture addressing units
  • 16 texture filtering units
  • 8 pixel rendering pipelines
  • Direct access to CPU L2 cache
  • 80nm process

eDRAM

  • 10MB 256GB/s eDRAM
  • Contains logic for:
    • 4-sample anti-aliasing
    • Alpha compositing
    • Color
    • Z/stencil buffering
  • 80nm process

Details

The only known change from Rhea to create Elpis was swizzling (flipping) the PCIe balls on the chip in order to match the ballout of the original 90nm Y1 chip it replaces. These chips are known to be reliable.

  • Part Number: X819195
  • Foundries:
    • Korea Foundry
    • Taiwan Foundry