Elpis (GPU): Difference between revisions

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| partnumber  = X819195
| partnumber  = X819195
| introduced  = Mid 2009
| introduced  = Mid 2009
| designedby  = ATi<br>Microsoft<br>NEC (eDRAM)
| designedby  = ATi<br>Microsoft
| codename    = C2
| type        = [[GPU]]
| type        = [[GPU]]
| usedin      = [[Elpis (Motherboard)]]
| usedin      = [[Elpis (Motherboard)]]
| clockspeed  = 500MHz
| clockspeed  = 500MHz
| memory      = 10MB [[eDRAM]]
| memory      = 10MB [[eDRAM]]
| process      = 80nm (Both dies)
| process      = 90nm (Both dies)
| package      = Flip-chip BGA1017
| package      = Flip-chip BGA1017
| predecessor  = [[Y1 (GPU)|Y1]]
| predecessor  = [[Y1 (GPU)|Y1]]
| successor    = [[Zeus]]
}}
}}
{{for|the motherboard|Elpis (Motherboard)}}
{{for|the motherboard|Elpis (Motherboard)}}
{{See also|Rhea}}
{{See also|Rhea}}


'''Elpis''' is an 80nm [[GPU]] specifically made for retrofitting faulty [[Xenon (Motherboard)|Xenon]] motherboards. Once retrofitted, the motherboard is referred to as [[Elpis (Motherboard)]]. The Elpis GPU was created by slightly modifying the fixed (higher Tg) version of the [[Rhea]] '''B14L''' core.
'''Elpis''' is a 90nm [[GPU]] specifically made for retrofitting faulty [[Xenon (Motherboard)|Xenon]] motherboards. Once retrofitted, the motherboard is also referred to as [[Elpis (Motherboard)|Elpis]]. The Elpis GPU was created by slightly modifying the fixed (higher Tg) version of the [[Rhea]] GPU.


== Specifications ==
== Specifications ==
=== GPU ===
=== GPU ===
{{GPU Specs}}
{{GPU Specs}}
* 80nm process
* B14L [[stepping]]
* 90nm process


=== eDRAM ===
=== eDRAM (Styx-90) ===
{{EDRAM Specs}}
{{EDRAM Specs}}
* 80nm process
* FS21 [[stepping]]
* 90nm process


== Details ==
== Details ==
The only known change from [[Rhea]] to create Elpis was swizzling (flipping) the PCIe balls on the chip in order to match the ballout of the original 90nm [[Y1 (GPU)|Y1]] chip it replaces. These chips are known to be reliable.
[[File:X819195-002-Korea.jpg|thumb|150px|upright|right|A Korean Elpis]]
The only known change from [[Rhea]] to create Elpis was swizzling (flipping) the PCIe balls on the chip in order to match the ballout of the original 90nm [[Y1 (GPU)|Y1]] chip it replaces. Like Rhea, it uses the [[Styx]]-90 [[eDRAM]]. These chips are known to be reliable.


* Part Number: X819195
* Part Number: X819195
* Foundries:
 
** {{Foundry|f=korea}}
== Prototypes ==
** {{Foundry|f=taiwan}}
Engineering Samples by [[stepping]].
 
=== B14L ===
Engineering sample for the final production chip, based off [[Rhea]].
 
[[File:X819715-002.jpg|150px]]
 
* Part Number: X819715-002


{{Motherboard Components}}
{{Motherboard Components}}
[[Category:Motherboard Components]]
[[Category:Motherboard Components]]

Latest revision as of 04:38, 5 April 2024

Elpis (GPU)
X819195-002.jpg
Part NumberX819195
IntroducedMid 2009
Designed ByATi
Microsoft
TypeGPU
Used InElpis (Motherboard)
Clock Speed500MHz
Memory10MB eDRAM
Process90nm (Both dies)
PackageFlip-chip BGA1017
PredecessorY1
SuccessorZeus

Elpis is a 90nm GPU specifically made for retrofitting faulty Xenon motherboards. Once retrofitted, the motherboard is also referred to as Elpis. The Elpis GPU was created by slightly modifying the fixed (higher Tg) version of the Rhea GPU.

Specifications

GPU

  • 500Mhz clock speed
  • 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
  • Unified shader architecture
  • 16 texture addressing units
  • 16 texture filtering units
  • 8 pixel rendering pipelines
  • Direct access to CPU L2 cache
  • B14L stepping
  • 90nm process

eDRAM (Styx-90)

  • 10MB 256GB/s eDRAM
  • Contains logic for:
    • 4-sample anti-aliasing
    • Alpha compositing
    • Color
    • Z/stencil buffering
  • FS21 stepping
  • 90nm process

Details

A Korean Elpis

The only known change from Rhea to create Elpis was swizzling (flipping) the PCIe balls on the chip in order to match the ballout of the original 90nm Y1 chip it replaces. Like Rhea, it uses the Styx-90 eDRAM. These chips are known to be reliable.

  • Part Number: X819195

Prototypes

Engineering Samples by stepping.

B14L

Engineering sample for the final production chip, based off Rhea.

X819715-002.jpg

  • Part Number: X819715-002