Rhea: Difference between revisions

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| image_size  = 150px
| image_size  = 150px
| caption      = Original Rhea (X810480)
| caption      = Original Rhea (X810480)
| image2      = X816970-001.jpg
| image2      = X816970-002.jpg
| image2_size  = 150px
| image2_size  = 150px
| caption2    = Revised Rhea (X816970)
| caption2    = Revised Rhea (X816970)
Line 12: Line 12:
| partnumber  = X810480<br>X816970<br>X816971
| partnumber  = X810480<br>X816970<br>X816971
| introduced  = Mid 2007
| introduced  = Mid 2007
| designedby  = ATi<br>Microsoft<br>NEC (eDRAM)
| designedby  = ATi<br>Microsoft
| codename    = C2
| codename    = Y2.5
| type        = [[GPU]]
| type        = [[GPU]]
| usedin      = [[Zephyr#Zephyr_C|Zephyr_C]]<br>[[Falcon]]
| usedin      = [[Zephyr#Zephyr_C|Zephyr_C]]<br>[[Falcon]]
| clockspeed  = 500MHz
| clockspeed  = 500MHz
| memory      = 10MB [[eDRAM]]
| memory      = 10MB [[eDRAM]]
| process      = 80nm (Both dies)
| process      = 90nm (Both dies)
| package      = Flip-chip BGA1017
| package      = Flip-chip BGA1017
| predecessor  = [[Y2 (GPU)|Y2]]
| predecessor  = [[Y2 (GPU)|Y2]]
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{{See also|Elpis (GPU)}}
{{See also|Elpis (GPU)}}


'''Rhea''' is the 80nm [[GPU]] used in the [[Zephyr#Zephyr_C|Zephyr_C]] and [[Falcon]] motherboards. It is the successor to [[Y2 (GPU)|Y2]] and uses the '''B14L''' core. No significant changes were made to the GPU. The [[eDRAM]] process was shrunk to 80nm.
'''Rhea''', codename '''Y2.5''', is a 90nm [[GPU]] and is used on the [[Zephyr#Zephyr_C|Zephyr_C]] and [[Falcon]] motherboards. It is the successor to [[Y2 (GPU)|Y2]]. No significant changes were made to the GPU. The [[eDRAM]] was changed from [[Edifis]] to [[Styx-90]].


== Specifications ==
== Specifications ==
=== GPU ===
=== GPU (Xenos C2) ===
{{GPU Specs}}
{{GPU Specs}}
* 80nm process
* B14L [[stepping]]
* 90nm process


=== eDRAM ===
=== eDRAM (Styx-90) ===
{{EDRAM Specs}}
{{EDRAM Specs}}
* 80nm process
* FS21 [[stepping]]
* 90nm process


== Details ==
== Details ==
All variants of Rhea use the [[Xenos C2]] [[GPU]] and [[Styx-90]] [[eDRAM]].


=== X810480 ===
=== X810480 ===
[[File:X810480-003-Korea.jpg|thumb|150px|upright|right|Fixed X810480 with higher Tg underfill from 2008]]
[[File:X810480-002-Fixed.jpg|thumb|150px|upright|right|Fixed X810480 with higher Tg underfill from 2010]]
[[File:X810480-002-Fixed.jpg|thumb|150px|upright|right|Fixed X810480 with higher Tg underfill from 2010]]


The initial version of GPU Rhea. {{Flip Chip Fault|t=overview}} Production of this chip paused sometime between {{Flip Chip Fault|t=ufswitchdate}}, and the [[#X816970|X816970]] and [[#X816971|X816971]] chips were produced instead to test fixed chips with different underfill materials. In Late-2008, X810480 {{Flip Chip Fault|t=fixed}}
The initial version of Rhea. {{Flip Chip Fault|t=overview}} Production of this chip paused sometime between {{Flip Chip Fault|t=ufswitchdate}}, and the [[#X816970|X816970]] and [[#X816971|X816971]] chips were produced instead to test fixed chips with different underfill materials. In Late-2009, X810480 {{Flip Chip Fault|t=fixed}}


* Part Number: X810480
* Part Number: X810480
* Foundries:
** {{Foundry|f=korea}}
** {{Foundry|f=taiwan}}


=== X816970 ===
=== X816970 ===
A revised version of GPU Rhea with higher Tg underfill material that appears dark. Some versions are marked with "Htg85". These chips are known to be reliable.
A revised version of Rhea with higher Tg underfill material that appears dark. Some versions are marked with "Htg85". These chips are known to be reliable.


* Part Number: X816970
* Part Number: X816970
* Foundries:
** {{Foundry|f=korea}}
** {{Foundry|f=taiwan}}


=== X816971 ===
=== X816971 ===
[[File:X816971-002-Htg130.jpg|thumb|150px|upright|right|X816971 marked with Htg130]]
[[File:X816971-002-Htg130.jpg|thumb|150px|upright|right|X816971 marked with Htg130]]


A second revised version of GPU Rhea with higher Tg underfill material that appears milky white. Some versions are marked with "Htg130". These chips are known to be reliable.
A second revised version of Rhea with higher Tg underfill material that appears milky white. Some versions are marked with "Htg130". These chips are known to be reliable.


* Part Number: X816971
* Part Number: X816971
* Foundry: {{Foundry|f=korea}}
 
== Prototypes ==
Engineering Samples by [[stepping]].
 
=== B13L ===
First version. Rhea version of [[Y2 (GPU)#B13L|Y2 B13L ES]].
 
[[File:X810634-002.jpg|150px]]
 
* Part Number: X810634-002


{{Motherboard Components}}
{{Motherboard Components}}
[[Category:Motherboard Components]]
[[Category:Motherboard Components]]

Latest revision as of 23:27, 23 August 2024

Rhea
X810480-003.jpg
Original Rhea (X810480)
X816970-002.jpg
Revised Rhea (X816970)
X816971-002.jpg
Revised Rhea (X816971)
Part NumberX810480
X816970
X816971
IntroducedMid 2007
Designed ByATi
Microsoft
CodenameY2.5
TypeGPU
Used InZephyr_C
Falcon
Clock Speed500MHz
Memory10MB eDRAM
Process90nm (Both dies)
PackageFlip-chip BGA1017
PredecessorY2
SuccessorZeus
See also: Elpis (GPU)

Rhea, codename Y2.5, is a 90nm GPU and is used on the Zephyr_C and Falcon motherboards. It is the successor to Y2. No significant changes were made to the GPU. The eDRAM was changed from Edifis to Styx-90.

Specifications

GPU (Xenos C2)

  • 500Mhz clock speed
  • 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
  • Unified shader architecture
  • 16 texture addressing units
  • 16 texture filtering units
  • 8 pixel rendering pipelines
  • Direct access to CPU L2 cache
  • B14L stepping
  • 90nm process

eDRAM (Styx-90)

  • 10MB 256GB/s eDRAM
  • Contains logic for:
    • 4-sample anti-aliasing
    • Alpha compositing
    • Color
    • Z/stencil buffering
  • FS21 stepping
  • 90nm process

Details

All variants of Rhea use the Xenos C2 GPU and Styx-90 eDRAM.

X810480

Fixed X810480 with higher Tg underfill from 2010

The initial version of Rhea. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. Production of this chip paused sometime between weeks 12 through 20 of 2008, and the X816970 and X816971 chips were produced instead to test fixed chips with different underfill materials. In Late-2009, X810480 chips with higher Tg underfill began being produced. These revised chips are known to be reliable.

  • Part Number: X810480

X816970

A revised version of Rhea with higher Tg underfill material that appears dark. Some versions are marked with "Htg85". These chips are known to be reliable.

  • Part Number: X816970

X816971

X816971 marked with Htg130

A second revised version of Rhea with higher Tg underfill material that appears milky white. Some versions are marked with "Htg130". These chips are known to be reliable.

  • Part Number: X816971

Prototypes

Engineering Samples by stepping.

B13L

First version. Rhea version of Y2 B13L ES.

X810634-002.jpg

  • Part Number: X810634-002
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