Corona: Difference between revisions
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* [[Winbond RAM#W641GG2JB-14|Winbond W641GG2JB-14]] RAM has been replaced with [[Winbond RAM#W641GG2KB-14|Winbond W641GG2KB-14]] (Rreferred to by the community as WB2K) | * [[Winbond RAM#W641GG2JB-14|Winbond W641GG2JB-14]] RAM has been replaced with [[Winbond RAM#W641GG2KB-14|Winbond W641GG2KB-14]] (Rreferred to by the community as WB2K) | ||
* [[Samsung RAM#K4J10324KE-HC14|Samsung K4J10324K'''E'''-HC14]] RAM has been replaced with [[Samsung RAM#K4J10324KG-HC14|Samsung K4J10324K'''G'''-HC14]] | * [[Samsung RAM#K4J10324KE-HC14|Samsung K4J10324K'''E'''-HC14]] RAM has been replaced with [[Samsung RAM#K4J10324KG-HC14|Samsung K4J10324K'''G'''-HC14]] | ||
* The 4GB [[Nand#Hynix H26M31001FPR|Hynix H26M3100'''1F'''PR]] eMMC on [[Xbox 360 | * The 4GB [[Nand#Hynix H26M31001FPR|Hynix H26M3100'''1F'''PR]] eMMC on [[Xbox 360 E#4GB|4GB]] SKUs has been replaced with the 4GB [[Nand#SK Hynix H26M31002GPR|SK Hynix H26M3100'''2G'''PR]] | ||
* The 4GB [[Nand#Toshiba THGBM5G5A1JBAIR|Toshiba THGBM5G5A1JBAIR]] eMMC was added as an option on [[Xbox 360 E#4GB|4GB]] SKUs | |||
* The [[A/V Multi]] port and most of its circuitry have been removed and replaced by composite video out | * The [[A/V Multi]] port and most of its circuitry have been removed and replaced by composite video out | ||
* The DC jack has been revised to a single barrel | * The DC jack has been revised to a single barrel | ||
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** 16MB [[Nand#ST NAND128W3A2BN6|ST NAND128W3A2BN6]] | ** 16MB [[Nand#ST NAND128W3A2BN6|ST NAND128W3A2BN6]] | ||
** 4GB [[Nand#SK Hynix H26M31002GPR|SK Hynix H26M31002GPR]] eMMC | ** 4GB [[Nand#SK Hynix H26M31002GPR|SK Hynix H26M31002GPR]] eMMC | ||
** 4GB [[Nand#Toshiba THGBM5G5A1JBAIR|Toshiba THGBM5G5A1JBAIR]] eMMC | |||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Revision as of 23:35, 20 December 2022
The Corona is the successor to the Trinity and is used in the Xbox 360 S. Corona is similar to Trinity but simplifies the system significantly.
Commonly referred to by the community (but not by Microsoft) as the "Corona V1" (16MB) and "Corona V2" (4GB).
Notable Differences
- The PSB has been replaced with the KSB
- The HANA and Ethernet PHY are removed, their functionality has been integrated into the KSB
- Elpida U1032AABG-14-F RAM is no longer used
- A 4GB Hynix & Phison MMC solution has been added on 4GB SKUs
- The 4GB Memory Unit daughterboard and connector were removed
- The standby voltage regulation has been redesigned
- The V_1P8STBY power rail has been replaced with V_1P2STBY
- The board layout has been simplified and cleaned up
Specifications
- 45nm IBM/ATi Valhalla CGPU with integrated 65nm eDRAM
- 512MB DDR3 RAM
- 4x128MB Hynix H5RS1H23MFR
- 4x128MB Samsung K4J10324KE-HC14
- KSB Southbridge
- Nand
- 16MB Hynix HY27US08281A
- 16MB ST NAND128W3A2BN6
- 4GB Hynix H27UBG8T2BTA with Phison PS7000 MMC controller
Waitsburg
The Corona Waitsburg is the successor to the Corona and is the final motherboard used in the Xbox 360 S. It is extremely similar to Corona, with a few minor differences.
Commonly referred to by the community (but not by Microsoft) as the "Corona V3" (16MB) and "Corona V4" (4GB).
Notable Differences
- Samsung K4J10324KG-HC14 and Winbond W641GG2JB-14 RAM have been added as options
- Hynix H5RS1H23MFR RAM is no longer used
- The 4GB Hynix & Phison MMC solution on 4GB SKUs has been replaced by a 4GB Hynix H26M31001FPR eMMC
- The POST_OUT traces from the CGPU have been removed
- Minor board layout changes
Specifications
- 45nm IBM/ATi Valhalla CGPU with integrated 65nm eDRAM
- 512MB DDR3 RAM
- 4x128MB Samsung K4J10324KE-HC14
- 4x128MB Samsung K4J10324KG-HC14
- 4x128MB Winbond W641GG2JB-14
- KSB Southbridge
- Nand
- 16MB Hynix HY27US08281A
- 16MB ST NAND128W3A2BN6
- 4GB Hynix H26M31001FPR eMMC
Stingray
The Corona Stingray is the successor to the Corona Waitsburg and is the first motherboard used in the Xbox 360 E. It is extremely similar to Waitsburg, with a few differences.
Commonly referred to by the community (but not by Microsoft) as the "Corona V5" (16MB) and "Corona V6" (4GB).
Notable Differences
- Winbond W641GG2JB-14 RAM has been replaced with Winbond W641GG2KB-14 (Rreferred to by the community as WB2K)
- Samsung K4J10324KE-HC14 RAM has been replaced with Samsung K4J10324KG-HC14
- The 4GB Hynix H26M31001FPR eMMC on 4GB SKUs has been replaced with the 4GB SK Hynix H26M31002GPR
- The 4GB Toshiba THGBM5G5A1JBAIR eMMC was added as an option on 4GB SKUs
- The A/V Multi port and most of its circuitry have been removed and replaced by composite video out
- The DC jack has been revised to a single barrel
- The rear triple USB port has been reduced to a dual USB port
- SPDIF has been removed from the rear I/O
- The rotation sensor has been removed
- Audible Feedback has been removed
- The 1575 RF board is now used
- Minor board layout changes
Specifications
- 45nm IBM/ATi Valhalla CGPU with integrated 65nm eDRAM
- 512MB DDR3 RAM
- 4x128MB Samsung K4J10324KG-HC14
- 4x128MB Winbond W641GG2KB-14
- KSB Southbridge
- Nand
- 16MB Hynix HY27US08281A
- 16MB ST NAND128W3A2BN6
- 4GB SK Hynix H26M31002GPR eMMC
- 4GB Toshiba THGBM5G5A1JBAIR eMMC