Y2 (GPU): Difference between revisions
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'''Y2''' is an 80nm [[GPU]] used in the [[Xbox 360]]. It is the successor to [[Y1 (GPU)|Y1]] | '''Y2''', also known as '''B13L''' is an 80nm [[GPU]] used in the [[Xbox 360]]. It is the successor to [[Y1 (GPU)|Y1]]. Minimal changes were required to move from the 90nm to the 80nm process. The [[eDRAM]] was not shrunk and remains on a 90nm process. | ||
== Specifications == | == Specifications == |
Revision as of 18:45, 12 March 2023
Part Number | X02127 |
---|---|
Introduced | Early 2007 |
Designed By | ATi Microsoft NEC (eDRAM) |
Codename | C2 |
Type | GPU |
Used In | Zephyr_B |
Clock Speed | 500MHz |
Memory | 10MB eDRAM |
Process | 80nm (GPU die) 90nm (eDRAM die) |
Package | Flip-chip BGA1017 |
Predecessor | Y1 |
Successor | Rhea |
Y2, also known as B13L is an 80nm GPU used in the Xbox 360. It is the successor to Y1. Minimal changes were required to move from the 90nm to the 80nm process. The eDRAM was not shrunk and remains on a 90nm process.
Specifications
GPU
- 500Mhz clock speed
- 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
- Unified shader architecture
- 16 texture addressing units
- 16 texture filtering units
- 8 pixel rendering pipelines
- Direct access to CPU L2 cache
- 80nm process
eDRAM
- 10MB 256GB/s eDRAM
- Contains logic for:
- 4-sample anti-aliasing
- Alpha compositing
- Color
- Z/stencil buffering
- 90nm process
Details
The PCIe ballout was de-swizzled (flipped) for the Zephyr_B motherboard, making this chip incompatible earlier motherboards. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.
- Part Number: X02127
- Foundries:
- Korea Foundry
- Taiwan Foundry