Y2 (GPU): Difference between revisions
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* Part Number: X807078-002 | * Part Number: X807078-002 | ||
=== B13L === | === B13L === |
Revision as of 23:56, 4 April 2024
Part Number | X02127 |
---|---|
Introduced | Early 2007 |
Designed By | ATi Microsoft NEC (eDRAM) |
Codename | C2 |
Type | GPU |
Used In | Zephyr_B |
Clock Speed | 500MHz |
Memory | 10MB eDRAM |
Process | 90nm (Both dies) |
Package | Flip-chip BGA1017 |
Predecessor | Y1 |
Successor | Rhea |
Y2 is a 90nm GPU and is used on the Zephyr_B motherboard. It is the successor to Y1. Improvements were made which shrunk the physical size of the die. The eDRAM was unchanged.
Specifications
GPU
- 500Mhz clock speed
- 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
- Unified shader architecture
- 16 texture addressing units
- 16 texture filtering units
- 8 pixel rendering pipelines
- Direct access to CPU L2 cache
- B13L or B14L stepping
- 90nm process
eDRAM (Edifis)
- 10MB 256GB/s eDRAM
- Contains logic for:
- 4-sample anti-aliasing
- Alpha compositing
- Color
- Z/stencil buffering
- ES3 (C00) stepping
- 90nm process
Details
The PCIe ballout was de-swizzled (flipped) for the Zephyr_B motherboard, making this chip incompatible earlier motherboards. It uses the Edifis eDRAM. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.
- Part Number: X02127
Prototypes
Engineering Samples by stepping.
B11
The first version of the Y2 GPU.
- Part Number: TBD
B11L
Low power version of B11.
- Part Number: X807072-001
B12
Minor update from B11.
- Part Number: TBD
B12L
Low power version of B12.
- Part Number: X807078-002
B13L
Low power version of B13. Engineering sample for the final production chip.
- Part Number: TBD