Y2 (GPU): Difference between revisions
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| clockspeed = 500MHz | | clockspeed = 500MHz | ||
| memory = 10MB [[eDRAM]] | | memory = 10MB [[eDRAM]] | ||
| process = | | process = 90nm (Both dies) | ||
| package = Flip-chip BGA1017 | | package = Flip-chip BGA1017 | ||
| predecessor = [[Y1 (GPU)|Y1]] | | predecessor = [[Y1 (GPU)|Y1]] | ||
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}} | }} | ||
'''Y2''' is | '''Y2''' is a 90nm [[GPU]] and is used on the [[Zephyr#Zephyr_B|Zephyr_B]] motherboard. It is the successor to [[Y1 (GPU)|Y1]]. Improvements were made which shrunk the physical size of the die. The [[eDRAM]] was unchanged. | ||
== Specifications == | == Specifications == | ||
| Line 23: | Line 23: | ||
{{GPU Specs}} | {{GPU Specs}} | ||
* B13L or B14L [[stepping]] | * B13L or B14L [[stepping]] | ||
* | * 90nm process | ||
=== eDRAM (Edifis) === | === eDRAM (Edifis) === | ||
Revision as of 23:07, 4 April 2024
 | |
| Part Number | X02127 |
|---|---|
| Introduced | Early 2007 |
| Designed By | ATi Microsoft NEC (eDRAM) |
| Codename | C2 |
| Type | GPU |
| Used In | Zephyr_B |
| Clock Speed | 500MHz |
| Memory | 10MB eDRAM |
| Process | 90nm (Both dies) |
| Package | Flip-chip BGA1017 |
| Predecessor | Y1 |
| Successor | Rhea |
Y2 is a 90nm GPU and is used on the Zephyr_B motherboard. It is the successor to Y1. Improvements were made which shrunk the physical size of the die. The eDRAM was unchanged.
Specifications
GPU
- 500Mhz clock speed
- 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
- Unified shader architecture
- 16 texture addressing units
- 16 texture filtering units
- 8 pixel rendering pipelines
- Direct access to CPU L2 cache
- B13L or B14L stepping
- 90nm process
eDRAM (Edifis)
- 10MB 256GB/s eDRAM
- Contains logic for:
- 4-sample anti-aliasing
- Alpha compositing
- Color
- Z/stencil buffering
- ES3 (C00) stepping
- 90nm process
Details
The PCIe ballout was de-swizzled (flipped) for the Zephyr_B motherboard, making this chip incompatible earlier motherboards. It uses the Edifis eDRAM. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.
- Part Number: X02127