Surtr: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
| (One intermediate revision by the same user not shown) | |||
| Line 6: | Line 6: | ||
| introduced = Early 2011 | | introduced = Early 2011 | ||
| designedby = Microsoft | | designedby = Microsoft | ||
| type = | | type = Thermal Load | ||
| package = Flip-chip BGA899 | | package = Flip-chip BGA899 | ||
}} | }} | ||
'''Surtr''' is a thermal | '''Surtr''' is a thermal load dummy chip used during early development of the [[Oban]] [[CGPU]]. It is '''not''' a real CPU but just a dummy load to generate heat. | ||
== Details == | == Details == | ||
Latest revision as of 23:32, 8 August 2024
 | |
| Part Number | X856364 |
|---|---|
| Introduced | Early 2011 |
| Designed By | Microsoft |
| Type | Thermal Load |
| Package | Flip-chip BGA899 |
Surtr is a thermal load dummy chip used during early development of the Oban CGPU. It is not a real CPU but just a dummy load to generate heat.
Details
The die is smaller and rotated 90 degrees versus Oban. While physically similar to Oban, the pinout is entirely different making it electrically incompatible with any motherboard. Little else is known about Surtr.
- Part Number: X856364