Y2 (GPU): Difference between revisions
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'''Y2''' is a 90nm [[GPU]] and is used on the [[Zephyr#Zephyr_B|Zephyr_B]] motherboard. It is the successor to [[Y1 (GPU)|Y1]]. Improvements were made which shrunk the physical size of the die. The [[eDRAM]] was unchanged. | '''Y2''', codename '''C2''', is a 90nm [[GPU]] and is used on the [[Zephyr#Zephyr_B|Zephyr_B]] motherboard. It is the successor to [[Y1 (GPU)|Y1]]. Improvements were made which shrunk the physical size of the die. The [[eDRAM]] was unchanged. | ||
== Specifications == | == Specifications == | ||
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[[File:X02127-006.jpg|thumb|150px|upright|right|A B14L Y2]] | [[File:X02127-006.jpg|thumb|150px|upright|right|A B14L Y2]] | ||
The PCIe ballout was de-swizzled (flipped) for the [[Zephyr#Zephyr_B|Zephyr_B]] motherboard, making this chip incompatible earlier motherboards. It uses the [[Edifis]] [[eDRAM]]. {{Flip Chip Fault|t=overview}} {{Flip Chip Fault|t=nofixed}} | The PCIe ballout was de-swizzled (flipped) for the [[Zephyr#Zephyr_B|Zephyr_B]] motherboard, making this chip incompatible earlier motherboards. It uses the [[Xenos C2]] [[GPU]] and [[Edifis]] [[eDRAM]]. {{Flip Chip Fault|t=overview}} {{Flip Chip Fault|t=nofixed}} | ||
* Part Number: X02127 | * Part Number: X02127 | ||
== Prototypes == | |||
Engineering Samples by [[stepping]]. | |||
=== B11 === | |||
First version. | |||
* Part Number: Unknown | |||
=== B11L === | |||
Low power version of B11. | |||
[[File:X807072-001.jpg|150px]] | |||
* Part Number: X807072-001 | |||
=== B12 === | |||
Minor update. | |||
* Below chip is a B12 that appears to be later binned as B12L. | |||
[[File:X807077-002.jpg|150px]] | |||
* Part Number: X807077-002 | |||
=== B12L === | |||
Low power version of B12. | |||
[[File:X807078-002.jpg|150px]] | |||
* Part Number: X807078-002 | |||
=== B13L === | |||
Minor update. Engineering sample for the final B13L production chip. | |||
* In the first picture, the second part number likely denotes binning | |||
[[File:X807072-003.jpg|150px]] | |||
[[File:X807074-003.jpg|150px]] | |||
* Part Numbers: | |||
** X807072-003 | |||
** X807074-003 | |||
{{Motherboard Components}} | {{Motherboard Components}} | ||
[[Category:Motherboard Components]] | [[Category:Motherboard Components]] | ||
Latest revision as of 00:27, 24 August 2024
 | |
| Part Number | X02127 |
|---|---|
| Introduced | Early 2007 |
| Designed By | ATi Microsoft NEC (eDRAM) |
| Codename | C2 |
| Type | GPU |
| Used In | Zephyr_B |
| Clock Speed | 500MHz |
| Memory | 10MB eDRAM |
| Process | 90nm (Both dies) |
| Package | Flip-chip BGA1017 |
| Predecessor | Y1 |
| Successor | Rhea |
Y2, codename C2, is a 90nm GPU and is used on the Zephyr_B motherboard. It is the successor to Y1. Improvements were made which shrunk the physical size of the die. The eDRAM was unchanged.
Specifications
GPU
- 500Mhz clock speed
- 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
- Unified shader architecture
- 16 texture addressing units
- 16 texture filtering units
- 8 pixel rendering pipelines
- Direct access to CPU L2 cache
- B13L or B14L stepping
- 90nm process
eDRAM (Edifis)
- 10MB 256GB/s eDRAM
- Contains logic for:
- 4-sample anti-aliasing
- Alpha compositing
- Color
- Z/stencil buffering
- ES3 (C00) stepping
- 90nm process
Details
The PCIe ballout was de-swizzled (flipped) for the Zephyr_B motherboard, making this chip incompatible earlier motherboards. It uses the Xenos C2 GPU and Edifis eDRAM. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.
- Part Number: X02127
Prototypes
Engineering Samples by stepping.
B11
First version.
- Part Number: Unknown
B11L
Low power version of B11.
- Part Number: X807072-001
B12
Minor update.
- Below chip is a B12 that appears to be later binned as B12L.
- Part Number: X807077-002
B12L
Low power version of B12.
- Part Number: X807078-002
B13L
Minor update. Engineering sample for the final B13L production chip.
- In the first picture, the second part number likely denotes binning
- Part Numbers:
- X807072-003
- X807074-003