Y2 (GPU): Difference between revisions

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=== GPU ===
=== GPU ===
{{GPU Specs}}
{{GPU Specs}}
* B13L or B14L stepping
* B13L or B14L [[stepping]]
* 80nm process
* 80nm process


=== eDRAM ===
=== eDRAM ===
{{EDRAM Specs}}
{{EDRAM Specs}}
* C00 stepping (with B13L)
* C00 [[stepping]] (with B13L)
* ES3 stepping (with B14L)
* ES3 [[stepping]] (with B14L)
* 90nm process
* 90nm process



Revision as of 11:19, 10 July 2023

Y2
X02127-004.jpg
Part NumberX02127
IntroducedEarly 2007
Designed ByATi
Microsoft
NEC (eDRAM)
CodenameC2
TypeGPU
Used InZephyr_B
Clock Speed500MHz
Memory10MB eDRAM
Process80nm (GPU die)
90nm (eDRAM die)
PackageFlip-chip BGA1017
PredecessorY1
SuccessorRhea

Y2 is an 80nm GPU and is used on the Zephyr_B motherboard. It is the successor to Y1. Minimal changes were required to move from the 90nm to the 80nm process. The eDRAM was not shrunk and remains on a 90nm process.

Specifications

GPU

  • 500Mhz clock speed
  • 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
  • Unified shader architecture
  • 16 texture addressing units
  • 16 texture filtering units
  • 8 pixel rendering pipelines
  • Direct access to CPU L2 cache
  • B13L or B14L stepping
  • 80nm process

eDRAM

  • 10MB 256GB/s eDRAM
  • Contains logic for:
    • 4-sample anti-aliasing
    • Alpha compositing
    • Color
    • Z/stencil buffering
  • C00 stepping (with B13L)
  • ES3 stepping (with B14L)
  • 90nm process

Details

A Korean Y2
A B14L/Styx Y2

The PCIe ballout was de-swizzled (flipped) for the Zephyr_B motherboard, making this chip incompatible earlier motherboards. B13L versions use the Edifis eDRAM, while later B14L verions use the Styx eDRAM. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.

  • Part Number: X02127