Y2 (GPU)

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Y2
X02127-004.jpg
Part NumberX02127
IntroducedEarly 2007
Designed ByATi
Microsoft
NEC (eDRAM)
CodenameC2
TypeGPU
Used InZephyr_B
Clock Speed500MHz
Memory10MB eDRAM
Process90nm (Both dies)
PackageFlip-chip BGA1017
PredecessorY1
SuccessorRhea

Y2 is a 90nm GPU and is used on the Zephyr_B motherboard. It is the successor to Y1. Improvements were made which shrunk the physical size of the die. The eDRAM was unchanged.

Specifications

GPU

  • 500Mhz clock speed
  • 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
  • Unified shader architecture
  • 16 texture addressing units
  • 16 texture filtering units
  • 8 pixel rendering pipelines
  • Direct access to CPU L2 cache
  • B13L or B14L stepping
  • 90nm process

eDRAM (Edifis)

  • 10MB 256GB/s eDRAM
  • Contains logic for:
    • 4-sample anti-aliasing
    • Alpha compositing
    • Color
    • Z/stencil buffering
  • ES3 (C00) stepping
  • 90nm process

Details

A Korean Y2
A B14L Y2

The PCIe ballout was de-swizzled (flipped) for the Zephyr_B motherboard, making this chip incompatible earlier motherboards. It uses the Edifis eDRAM. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.

  • Part Number: X02127

Prototypes

Engineering Samples by stepping.

B11

The first version of the Y2 GPU.

  • Part Number: TBD

B11L

Low power version of B11.

X807072-001.jpg

  • Part Number: X807072-001

B12

Minor update from B11.

  • Part Number: TBD

B12L

Low power version of B12.

X807078-002.jpg

  • Part Number: X807078-002

B13L

Minor update from B12L. Engineering sample for the final B13L production chip.

  • Part Number: TBD

B14L

Minor update from B13L. Engineering sample for the final B14L production chip.

  • Part Number: TBD