Y2 (GPU)

Y2

Part Number	X02127
Introduced	Early 2007
Designed By	ATi Microsoft NEC (eDRAM)
Codename	C2
Type	GPU
Used In	Zephyr_B
Clock Speed	500MHz
Memory	10MB eDRAM
Process	90nm (Both dies)
Package	Flip-chip BGA1017
Predecessor	Y1
Successor	Rhea

Y2, codename C2, is a 90nm GPU and is used on the Zephyr_B motherboard. It is the successor to Y1. Improvements were made which shrunk the physical size of the die. The eDRAM was unchanged.

Specifications

GPU

• 500Mhz clock speed
• 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
• Unified shader architecture
• 16 texture addressing units
• 16 texture filtering units
• 8 pixel rendering pipelines
• Direct access to CPU L2 cache
• B13L or B14L stepping
• 90nm process

eDRAM (Edifis)

• 10MB 256GB/s eDRAM
• Contains logic for:
  • 4-sample anti-aliasing
  • Alpha compositing
  • Color
  • Z/stencil buffering
• ES3 (C00) stepping
• 90nm process

Details

A Korean Y2

A B14L Y2

The PCIe ballout was de-swizzled (flipped) for the Zephyr_B motherboard, making this chip incompatible earlier motherboards. It uses the Edifis eDRAM. This chip contains a design defect in which low Tg underfill is used to support the bumps. This causes reliability issues and premature failure of the chip. No versions with higher Tg underfill were produced. Thus, no versions of this chip are known to be reliable.

• Part Number: X02127

Prototypes

Engineering Samples by stepping.

B11

First version.

• Part Number: Unknown

B11L

Low power version of B11.

• Part Number: X807072-001

B12

Minor update.

• Below chip is a B12 that appears to be later binned as B12L.

• Part Number: X807077-002

B12L

Low power version of B12.

• Part Number: X807078-002

B13L

Minor update. Engineering sample for the final B13L production chip.

• In the first picture, the second part number likely denotes binning

• Part Numbers:
  • X807072-003
  • X807074-003