Xenon (Motherboard): Difference between revisions

From XenonLibrary
Jump to navigation Jump to search
No edit summary
No edit summary
Line 27: Line 27:
* 90nm IBM [[Waternoose (CPU)#Waternoose2|Waternoose2]] CPU
* 90nm IBM [[Waternoose (CPU)#Waternoose2|Waternoose2]] CPU
* 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm [[eDRAM]]
* 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm [[eDRAM]]
* 512MB (8x64MB) Infineon or Samsung DDR3 RAM
* 512MB DDR3 RAM
** 8x64MB [[Qimonda RAM#HYB18H1G321AF-14|Infineon HYB18H1G321AF-14]]
** 8x64MB [[Samsung RAM#K4J52324QC-BC14|Samsung K4J52324QC-BC14]]
* [[XSB]] Southbridge
* [[XSB]] Southbridge
* [[ANA]]
* [[ANA]]

Revision as of 17:39, 20 December 2022

Template:Infobox Component

The Xenon motherboard is the first final motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.

Notes

  • At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
  • Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
  • Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)

Specifications