Xenon (Motherboard): Difference between revisions
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* 90nm IBM [[Waternoose2 (CPU)|Waternoose2]] CPU | * 90nm IBM [[Waternoose2 (CPU)|Waternoose2]] CPU | ||
* 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm [[eDRAM]] | * 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm [[eDRAM]] | ||
* 512MB (8x64MB) Samsung | * 512MB (8x64MB) Infineon or Samsung DDR3 RAM | ||
* [[XSB]] Southbridge | * [[XSB]] Southbridge | ||
* [[ANA]] | * [[ANA]] | ||
Revision as of 16:10, 20 December 2022
The Xenon motherboard is the first final motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.
Notes
- At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
Specifications
- 90nm IBM Waternoose2 CPU
- 90nm ATi Y1 GPU with integrated 90nm eDRAM
- 512MB (8x64MB) Infineon or Samsung DDR3 RAM
- XSB Southbridge
- ANA
- Nand: Hynix 16MB
- Ethernet: Boardcom or ICS
- Clockgen: Cypress