Themis: Difference between revisions

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[[File:X816343-002-bga.jpg|thumb|150px|upright|right|Themis' BGA compared to a regular [[GPU]] (left) and [[XCGPU]] (right)]]
[[File:X816343-002-bga.jpg|thumb|150px|upright|right|Themis' BGA compared to a regular [[GPU]] (left) and [[XCGPU]] (right)]]


Little is known about Themis. The BGA layout is absolutely massive. The die etchings mention the [[Styx]]-90 stepping FS21, but it is not included on the package. The reason for this is unknown.
Little is known about Themis. The BGA layout is massive. The die etchings mention the [[Styx]]-90 stepping FS21, but it is not included on the package. The reason for this is unknown.


* Part Number: X816343
* Part Number: X816343

Revision as of 14:09, 15 May 2024

Themis
X816343-002.jpg
Part NumberX816343
IntroducedEarly 2008
Designed ByMicrosoft
TypeGPU
Clock Speed500MHz
Process65nm
PackageUnknown

Themis is an engineering sample GPU likely created to evaluate final Gunga silicon.

Specifications

GPU

  • 500Mhz clock speed
  • 48 floating-point vector processors divided into 3 dynamically scheduled SIMD groups (16 each)
  • Unified shader architecture
  • 16 texture addressing units
  • 16 texture filtering units
  • 8 pixel rendering pipelines
  • Direct access to CPU L2 cache
  • C22 stepping
  • 65nm process

Details

Themis' BGA compared to a regular GPU (left) and XCGPU (right)

Little is known about Themis. The BGA layout is massive. The die etchings mention the Styx-90 stepping FS21, but it is not included on the package. The reason for this is unknown.

  • Part Number: X816343