Xenon (Motherboard): Difference between revisions
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* Boardcom or ICS Ethernet PHY | * Boardcom or ICS Ethernet PHY | ||
* Cypress Clock Generator | * Cypress Clock Generator | ||
== Elpis == | |||
{{Infobox Component | |||
| name = Elpis | |||
| introduced = Early 2009 | |||
| partnumber = X803600 (Board)<br>X807381 (Sticker) | |||
| type = Motherboard | |||
| usedin = [[Xbox 360 (Original)]] | |||
| cputype = [[Waternoose (CPU)#Waternoose2|Waternoose2]] | |||
| gputype = [[Elpis (GPU)|Elpis]] | |||
| cpuprocess = 90nm | |||
| gpuprocess = 80nm | |||
| edramprocess = 80nm | |||
| nandsize = 16MB | |||
| video = [[A/V Multi]] | |||
| wattage = 203W | |||
| 12vamps = 16.5A | |||
}} | |||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Revision as of 19:30, 20 December 2022
The Xenon motherboard is the first final motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.
Notes
- At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
- At some point in 2006, the extended GPU heatsink started being used instead of the low profile GPU heatsink
Specifications
- 90nm IBM Waternoose2 CPU
- 90nm ATi Y1 GPU with integrated 90nm eDRAM
- 512MB DDR3 RAM
- 8x64MB Infineon HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator