Xenon (Motherboard): Difference between revisions
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* [[XSB]] Southbridge | * [[XSB]] Southbridge | ||
* [[ANA]] | * [[ANA]] | ||
* Hynix | * 16MB [[Nand#Hynix HY27US08281A|Hynix HY27US08281A]] Nand | ||
* Boardcom or ICS Ethernet PHY | * Boardcom or ICS Ethernet PHY | ||
* Cypress Clock Generator | * Cypress Clock Generator | ||
[[Category:Motherboards]] | [[Category:Motherboards]] | ||
Revision as of 18:25, 20 December 2022
The Xenon motherboard is the first final motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.
Notes
- At some point in 2006, at least one of the manufacturers of the Xenon started applying glue around the CPU and GPU, likely as an attempt to reduce the failure rate
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
Specifications
- 90nm IBM Waternoose2 CPU
- 90nm ATi Y1 GPU with integrated 90nm eDRAM
- 512MB DDR3 RAM
- 8x64MB Infineon HYB18H1G321AF-14
- 8x64MB Samsung K4J52324QC-BC14
- XSB Southbridge
- ANA
- 16MB Hynix HY27US08281A Nand
- Boardcom or ICS Ethernet PHY
- Cypress Clock Generator