Xenon (Motherboard): Difference between revisions
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The '''Xenon''' motherboard is the first final motherboard and is used in the [[Original Xbox 360]] series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the [[ANA]] chip. | The '''Xenon''' motherboard is the first final motherboard and is used in the [[Original Xbox 360]] series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the [[ANA]] chip. | ||
== Specifications == | === Notes === | ||
* At some point in 2006, at least one of the manufactures of the Xenon started applying glue around the CPU and GPU during manufacturing, likely as an attempt to reduce the failure rate | |||
* Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors | |||
* Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see [https://en.wikipedia.org/wiki/Capacitor_plague Capacitor Plague] for details) | |||
=== Specifications === | |||
* 90nm IBM [[Waternoose2 (CPU)|Waternoose2]] CPU | * 90nm IBM [[Waternoose2 (CPU)|Waternoose2]] CPU | ||
* 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm [[eDRAM]] | * 90nm ATi [[Y1 (GPU)|Y1]] GPU with integrated 90nm [[eDRAM]] | ||
Revision as of 15:05, 20 December 2022
The Xenon motherboard is the first final motherboard and is used in the Original Xbox 360 series. The motherboard has a unique board layout compared to the later boards, especially noticeable with the capacitors around the CPU heatsink, and use of the ANA chip.
Notes
- At some point in 2006, at least one of the manufactures of the Xenon started applying glue around the CPU and GPU during manufacturing, likely as an attempt to reduce the failure rate
- Some consoles use small yellow 820uF capacitors, while other consoles use silver 820uF solid capacitors
- Some capacitors used for voltage regulation positioned around the CPU heatsink are defective and prone to failure (see Capacitor Plague for details)
Specifications
- 90nm IBM Waternoose2 CPU
- 90nm ATi Y1 GPU with integrated 90nm eDRAM
- 512MB (8x64MB) Samsung or Infineon DDR3 RAM
- XSB Southbridge
- ANA
- Nand: Hynix 16MB
- Ethernet: Boardcom or ICS
- Clockgen: Cypress