Surtr: Difference between revisions
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(Created page with "{{Infobox Chip | name = Surtr | image = X856364-001.jpg | image_size = 150px | partnumber = X856364 | introduced = Early 2011 | designedby = Microsoft | type = FPGA | package = Flip-chip BGA899 }} '''Surtr''' is a test chip used during early development of the Oban CGPU. It is '''not''' a real CPU, it is an FPGA which was likely used for testing early HDL for Oban. == Details == The die is smaller and rotated 90 degrees versu...") |
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| introduced = Early 2011 | | introduced = Early 2011 | ||
| designedby = Microsoft | | designedby = Microsoft | ||
| type = | | type = Thermal Load | ||
| package = Flip-chip BGA899 | | package = Flip-chip BGA899 | ||
}} | }} | ||
'''Surtr''' is a | '''Surtr''' is a thermal load dummy chip used during early development of the [[Oban]] [[CGPU]]. It is '''not''' a real CPU but just a dummy load to generate heat. | ||
== Details == | == Details == | ||
The die is smaller and rotated 90 degrees versus [[Oban]]. | The die is smaller and rotated 90 degrees versus [[Oban]]. While physically similar to Oban, the pinout is entirely different making it electrically incompatible with any [[motherboard]]. Little else is known about Surtr. | ||
* Part Number: X856364 | * Part Number: X856364 | ||
Latest revision as of 00:32, 9 August 2024
 | |
| Part Number | X856364 |
|---|---|
| Introduced | Early 2011 |
| Designed By | Microsoft |
| Type | Thermal Load |
| Package | Flip-chip BGA899 |
Surtr is a thermal load dummy chip used during early development of the Oban CGPU. It is not a real CPU but just a dummy load to generate heat.
Details
The die is smaller and rotated 90 degrees versus Oban. While physically similar to Oban, the pinout is entirely different making it electrically incompatible with any motherboard. Little else is known about Surtr.
- Part Number: X856364